公开(公告)号：US20080073795A1

公开(公告)日：2008-03-27

申请号：US11534668

申请日：2006-09-24

申请人： PAUL A. KOHL ,  ATE HE ,  TYLER OSBORN

发明人： PAUL A. KOHL ,  ATE HE ,  TYLER OSBORN

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/10126 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00

摘要： Integrated circuit interconnection devices and methods are provided. An interconnection to connect components can comprise a first portion, a second portion, and a joining portion. The first portion can extend from a first component, and the first portion can be made with a single conductor. The second portion can extend from a second component, and the second portion can be made with the single conductor. The joining section can be disposed between the first portion and the second portion so that the first component and second component are interconnected to each other to form an interconnect. The joining section can be made of the single conductor so that the interconnect structure consists only of the single conductor. An interconnect can also be formed with two portions, and be formed to have a high-aspect ratio. Other embodiments are also claimed and described.

摘要翻译： 提供集成电路互连设备和方法。 连接组件的互连可以包括第一部分，第二部分和接合部分。 第一部分可以从第一部件延伸，并且第一部分可以由单个导体制成。 第二部分可以从第二部件延伸，并且第二部分可以由单个导体制成。 接合部可以设置在第一部分和第二部分之间，使得第一部件和第二部件彼此互连以形成互连。 接合部分可以由单个导体制成，使得互连结构仅由单个导体组成。 互连也可以形成为两部分，并且形成为具有高纵横比。 还要求保护和描述其它实施例。

公开(公告)号：US20070105429A1

公开(公告)日：2007-05-10

申请号：US11557073

申请日：2006-11-06

申请人： PAUL KOHL ,  ATE HE ,  MARK CUPTA ,  MUHANNAD BAKIR ,  TODD SPENCER

发明人： PAUL KOHL ,  ATE HE ,  MARK CUPTA ,  MUHANNAD BAKIR ,  TODD SPENCER

IPC分类号： H01R4/24

CPC分类号： H01L23/66 ,  H01L21/7682 ,  H01L23/5225 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01P1/047 ,  H05K1/0219 ,  H05K3/4644 ,  H05K2201/09809

摘要： High performance interconnect devices, structures, and fabrication methods are provided herein. According to some embodiments of the present invention, an interconnect device used to connect components or route signals in an integrated circuit can comprise multiple conductors. A first conductor of the interconnect device can define a first conductor axis, and a second conductor of the interconnect device can define a second conductor axis. The second conductor can be proximate the first conduct such that first conductor axis is substantially coaxially situated relative to the second conductor axis to provide a high performance interconnect having a coaxial alignment. The first conductor and the second conductor can define a gap disposed between and separating the conductors. Other embodiments are also claimed and described.

摘要翻译： 本文提供了高性能互连器件，结构和制造方法。 根据本发明的一些实施例，用于连接集成电路中的部件或路由信号的互连装置可以包括多个导体。 互连装置的第一导体可以限定第一导体轴线，并且互连装置的第二导体可以限定第二导体轴线。 第二导体可以靠近第一导体，使得第一导体轴线相对于第二导体轴线基本上同轴地定位，以提供具有同轴对准的高性能互连。 第一导体和第二导体可以限定设置在导体和分离导体之间的间隙。 还要求保护和描述其它实施例。