公开(公告)号：US12038802B2

公开(公告)日：2024-07-16

申请号：US17070520

申请日：2020-10-14

Applicant: PDF Solutions, Inc.

Inventor： Tomonori Honda ,  Richard Burch ,  John Kibarian ,  Lin Lee Cheong ,  Qing Zhu ,  Vaishnavi Reddipalli ,  Kenneth Harris ,  Said Akar ,  Jeffrey D David ,  Michael Keleher ,  Brian Stine ,  Dennis Ciplickas

IPC: G06N20/00 ,  G06F11/07 ,  G06F18/211 ,  G06F18/241 ,  G06F18/40 ,  H01L21/02 ,  G06F3/0482 ,  G06N3/08 ,  G06N7/01

CPC classification number: G06F11/079 ,  G06F11/0736 ,  G06F11/0751 ,  G06F11/0778 ,  G06F18/211 ,  G06F18/241 ,  G06F18/40 ,  G06N20/00 ,  H01L21/02 ,  G06F3/0482 ,  G06N3/08 ,  G06N7/01

Abstract: Classifying wafers using Collaborative Learning. An initial wafer classification is determined by a rule-based model. A predicted wafer classification is determined by a machine learning model. Multiple users can manually review the classifications to confirm or modify, or to add user classifications. All of the classifications are input to the machine learning model to continuously update its scheme for detection and classification.

公开(公告)号：US20210142122A1

公开(公告)日：2021-05-13

申请号：US17070520

申请日：2020-10-14

Applicant: PDF Solutions, Inc.

Inventor： Tomonori Honda ,  Richard Burch ,  John Kibarian ,  Lin Lee Cheong ,  Qing Zhu ,  Vaishnavi Reddipalli ,  Kenneth Harris ,  Said Akar ,  Jeffrey D David ,  Michael Keleher ,  Brian Stein ,  Dennis Ciplickas

IPC: G06K9/62 ,  G06N20/00 ,  H01L21/02

Abstract: Classifying wafers using Collaborative Learning. An initial wafer classification is determined by a rule-based model. A predicted wafer classification is determined by a machine learning model. Multiple users can manually review the classifications to confirm or modify, or to add user classifications. All of the classifications are input to the machine learning model to continuously update its scheme for detection and classification.