公开(公告)号：US10410909B2

公开(公告)日：2019-09-10

申请号：US16132780

申请日：2018-09-17

申请人： PIOTECH CO., LTD.

发明人： Ren Zhou ,  Xuyen Pham ,  Shichai Fang

IPC分类号： H01L21/687 ,  H01L21/67 ,  H01L21/677

摘要： The invention discloses a support structure for a wafer pedestal; particularly the wafer pedestal has a wafer carrying surface defining holes for accommodation of the support structure. The support structure includes a first surface and extends therebetween. The first surface includes a rising portion for supporting wafer. A center of the first surface and a center of the second surface define an axis that is not parallel to the normal of the first surface. That is, the first surface extends oblique relatively to the second surface such that the support structure according to the invention can be received in the pedestal in an oblique way relative to the wafer carrying surface of the pedestal.

公开(公告)号：US20190096736A1

公开(公告)日：2019-03-28

申请号：US16132780

申请日：2018-09-17

申请人： PIOTECH CO., LTD.

发明人： Ren Zhou ,  Xuyen Pham ,  Shichai Fang

IPC分类号： H01L21/687 ,  H01L21/67

CPC分类号： H01L21/68714 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/6875 ,  H01L21/68785

摘要： The invention discloses a support structure for a wafer pedestal; particularly the wafer pedestal has a wafer carrying surface defining holes for accommodation of the support structure. The support structure includes a first surface and extends therebetween. The first surface includes a rising portion for supporting wafer. A center of the first surface and a center of the second surface define an axis that is not parallel to the normal of the first surface. That is, the first surface extends oblique relatively to the second surface such that the support structure according to the invention can be received in the pedestal in an oblique way relative to the wafer carrying surface of the pedestal.

公开(公告)号：US20170271187A1

公开(公告)日：2017-09-21

申请号：US15267698

申请日：2016-09-16

申请人： PIOTECH CO., LTD.

发明人： Ren ZHOU ,  Xuyen Pham ,  Brian Lu ,  Sean Chang ,  Shicai Fang ,  Jie Lian ,  Enguo Men

IPC分类号： H01L21/673 ,  H01L21/687 ,  H01L21/677

CPC分类号： H01L21/67201

摘要： Disclosed is a load lock chamber which includes a chamber body including: at least one pair of cavities, defined in a layer structure of the chamber body to carry one or more wafer substrates; at least one internal conduit, defined between and coupled with the paired cavities, such that the paired cavities are communicated with each other and capable of conducting gas refilling and exhaustion; and a plurality of wafer supports for carrying the wafer substrates, the plurality of wafer supports being securely received in the paired cavities and able to calibrate with a machine arm frontend finger, wherein the wafer support includes grooves defined thereon for calibrating the machine arm frontend finger.