公开(公告)号：US20140197305A1

公开(公告)日：2014-07-17

申请号：US14145019

申请日：2013-12-31

Applicant: PIXART IMAGING INC.

Inventor： EN-FENG HSU ,  CHIA-YU LIU ,  CHING-WEI CHEN

IPC: G01S17/02 ,  H01L31/0232 ,  H01L31/18

CPC classification number: G01S17/026 ,  G01S7/4813 ,  H01L31/02325

Abstract: There is provided an optical apparatus including a substrate, a light emitting device, a light sensitive device and a plurality of micro-lenses. The light emitting device is disposed on the substrate and adapted to provide a light beam. The light sensitive device is disposed on the substrate and adapted to receive a light beam reflected from an object, wherein the light sensitive device has a plurality of photosensitive units arranged in matrix. The micro-lenses are disposed above the light sensitive device and respectively opposite to the associated photosensitive units. There is further provided a light sensitive device with micro-lens and a manufacturing method thereof.

Abstract translation: 提供了一种包括基板，发光装置，感光装置和多个微透镜的光学装置。 发光器件设置在衬底上并适于提供光束。 感光装置设置在基板上并适于接收从物体反射的光束，其中光敏装置具有多个布置成矩阵的感光单元。 微透镜设置在光敏装置上方并分别与相关感光单元相对。 还提供了一种具有微透镜的感光装置及其制造方法。

公开(公告)号：US20150380448A1

公开(公告)日：2015-12-31

申请号：US14659956

申请日：2015-03-17

Applicant: PIXART IMAGING INC.

Inventor： CHING-WEI CHEN ,  WEN-CHENG YEN

IPC: H01L27/146 ,  H01L49/02

CPC classification number: H01L27/1464 ,  H01L27/14609 ,  H01L27/14629

Abstract: There is provided a back side illuminated semiconductor structure with a semiconductor capacitor connected to a floating diffusion node in which the semiconductor capacitor for reducing a dimension of the floating diffusion node is provided above the floating diffusion node so as to eliminate the influence thereto by incident light and enhance the light absorption efficiency.

Abstract translation: 提供了具有连接到浮动扩散节点的半导体电容器的背面照明半导体结构，其中用于减小浮动扩散节点的尺寸的半导体电容器设置在浮动扩散节点上方，以消除入射光对其的影响 并提高光吸收效率。

公开(公告)号：US20180239018A1

公开(公告)日：2018-08-23

申请号：US15956313

申请日：2018-04-18

Applicant: PixArt Imaging Inc.

Inventor： EN-FENG HSU ,  CHIA-YU LIU ,  CHING-WEI CHEN

IPC: G01S17/02 ,  G01S7/481 ,  H01L31/0232

CPC classification number: G01S17/026 ,  G01S7/4813 ,  H01L31/02325

Abstract: There is provided an optical apparatus including a substrate, a light emitting device, a light sensitive device and a plurality of micro-lenses. The light emitting device is disposed on the substrate and adapted to provide a light beam. The light sensitive device is disposed on the substrate and adapted to receive a light beam reflected from an object, wherein the light sensitive device has a plurality of photosensitive units arranged in matrix. The micro-lenses are disposed above the light sensitive device and respectively opposite to the associated photosensitive units. There is further provided a light sensitive device with micro-lens and a manufacturing method thereof.

公开(公告)号：US20150325616A1

公开(公告)日：2015-11-12

申请号：US14590270

申请日：2015-01-06

Applicant: PIXART IMAGING INC.

Inventor： SEN-HUANG HUANG ,  HUAN-KUN PAN ,  YI-CHANG CHANG ,  CHING-WEI CHEN

IPC: H01L27/146

CPC classification number: H01L27/1462 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14685

Abstract: There is provided a front side illuminated (FSI) semiconductor structure with improved light absorption efficiency which is configured to provide a reflecting layer on a bottom of the FSI semiconductor structure to enhance the light absorption efficiency, wherein the reflecting layer is manufactured in the packaging process or the semiconductor process.

Abstract translation: 提供了具有改善的光吸收效率的前侧照明（FSI）半导体结构，其被配置为在FSI半导体结构的底部上提供反射层以增强光吸收效率，其中反射层在包装过程中制造 或半导体工艺。