公开(公告)号：US20230268204A1

公开(公告)日：2023-08-24

申请号：US18020262

申请日：2021-08-11

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Seung Ho PARK ,  Sung Hyun BYUN ,  Jeong Hyuk LEE

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L21/67144 ,  H01L21/6835 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68368

Abstract: A microelement transfer system includes a microelement carrier. The microelement carrier includes a first plate, a second plate, and a microelement support. The first plate has a plurality of first through-holes corresponding to respective microelements. The second plate is provided on the first plate and has a second through-hole having a smaller inner diameter than that of the first through-hole. At least one of the first plate and the second plate is made of an anodic oxide film material. The microelement support includes a carrier substrate on which the microelements are temporarily fixed. The microelement transfer system relatively moves at least one of the microelement carrier and the microelement support in at least one direction so that each of the microelements comes into contact with a side wall of a corresponding one of the first through-holes and detaches to be released from the temporarily fixed state.

公开(公告)号：US20240038569A1

公开(公告)日：2024-02-01

申请号：US18037081

申请日：2021-12-08

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Jeong Hyuk LEE

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  H01L2221/68354 ,  H01L2221/68322

Abstract: A micro device, a micro device alignment apparatus, and an alignment method using the same are proposed. In a micro device that has to be aligned with at least any one surface of front and rear surfaces of the micro device when mounted on a substrate and simultaneously be aligned with any one direction of the micro device when mounted on the substrate, there is provided the micro device, the micro device alignment apparatus, and the alignment method using the same so that surface alignment and direction alignment are simultaneously performed for a plurality of micro devices that is not aligned with at least any one surface of the front and rear surfaces and simultaneously is not aligned with any one direction.