公开(公告)号：US09779918B2

公开(公告)日：2017-10-03

申请号：US14542891

申请日：2014-11-17

Applicant: PSK INC.

Inventor： Chang Weon Lee

IPC: C23C16/00 ,  C23C16/50 ,  C23F1/00 ,  H01L21/306 ,  H01J37/32 ,  C23C16/44 ,  C23C16/458

CPC classification number: H01J37/32834 ,  C23C16/4412 ,  C23C16/4585 ,  H01J37/32091

Abstract: Provided is a substrate processing apparatus. The substrate treating apparatus includes a processing chamber, a substrate supporting unit, a plasma generation unit, a gas supplying unit, an exhaust adjusting unit, or the like. Residual gas and reaction by-products are generated in a chamber after a substrate is treated by using a gas supplied from the gas supplying unit or plasma excited by the plasma generation unit. The gas exhaust adjusting unit adjusts discharge amounts of residual gas and reaction by-products to adjust residence time or pressure of gas, plasma, or the like in the apparatus, thereby controlling a uniformity of the substrate treating process.

公开(公告)号：US09508541B2

公开(公告)日：2016-11-29

申请号：US14146314

申请日：2014-01-02

Applicant: PSK INC.

Inventor： Jongjin Lee ,  Bum Joon Park ,  Tae Hoon Kim ,  Chang Weon Lee ,  Sunwoong Yim ,  Han Kyu Lee

IPC: B08B6/00 ,  H01L21/02 ,  H01J37/32 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01L21/02046 ,  H01J37/32192 ,  H01J37/32779 ,  H01L21/02076 ,  H01L21/67383 ,  H01L21/67766 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/68707 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed, a plasma treatment unit supplying plasma to treat a top surface of the wafer, and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit.

Abstract translation: 提供了一种基板处理装置。 基板处理装置包括负载端口，载置有容纳多个基板的载体，背面晶片与固定在框架环上的安装带相连接，等离子体处理单元，其供给等离子体以处理 晶片和在载体和等离子体处理单元之间转移衬底的衬底转移单元。

公开(公告)号：US20140190513A1

公开(公告)日：2014-07-10

申请号：US14146314

申请日：2014-01-02

Applicant: PSK INC.

Inventor： Jongjin Lee ,  Bum Joon Park ,  Tae Hoon Kim ,  Chang Weon Lee ,  Sunwoong Yim ,  Han Kyu Lee

IPC: H01L21/02

CPC classification number: H01L21/02046 ,  H01J37/32192 ,  H01J37/32779 ,  H01L21/02076 ,  H01L21/67383 ,  H01L21/67766 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/68707 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed, a plasma treatment unit supplying plasma to treat a top surface of the wafer, and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit.

Abstract translation: 提供了一种基板处理装置。 基板处理装置包括负载端口，载置有容纳多个基板的载体，背面晶片与固定在框架环上的安装带相连接，等离子体处理单元，其供给等离子体以处理 晶片和在载体和等离子体处理单元之间转移衬底的衬底转移单元。