公开(公告)号：US20130237645A1

公开(公告)日：2013-09-12

申请号：US13872205

申请日：2013-04-29

Applicant: PANASONIC CORPORATION

Inventor： Hirohisa Hino ,  Taro Fukui ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Takayuki Higuchi

IPC: C08K13/02

CPC classification number: C08K13/02 ,  C08K5/09 ,  C22C12/00 ,  C22C28/00 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y10T428/31511 ,  C08L63/00

Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.

Abstract translation: 本发明涉及包含金属填料组分，助熔组分和热固性树脂粘合剂的热固性树脂组合物。 金属填料组分包括铋（Bi）和铟（In）和锡（Sn）中的至少一种。 使用以下结构式（1）的化合物和下述结构式（2）的化合物中的至少一种的助熔组分。 在上式中，R 1〜R 6各自为氢或烷基，X为具有单电子对或双键π电子且能够与金属配位的有机基团。

公开(公告)号：US08697237B2

公开(公告)日：2014-04-15

申请号：US13872205

申请日：2013-04-29

Applicant: Panasonic Corporation

Inventor： Hirohisa Hino ,  Taro Fukui ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Takayuki Higuchi

IPC: B32B27/38 ,  C08L63/00 ,  C08G59/18 ,  C08K3/08 ,  B32B15/092

CPC classification number: C08K13/02 ,  C08K5/09 ,  C22C12/00 ,  C22C28/00 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y10T428/31511 ,  C08L63/00

Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.

Abstract translation: 本发明涉及包含金属填料组分，助熔组分和热固性树脂粘合剂的热固性树脂组合物。 金属填料组分包括铋（Bi）和铟（In）和锡（Sn）中的至少一种。 使用以下结构式（1）的化合物和下述结构式（2）的化合物中的至少一种的助熔组分。 在上式中，R 1〜R 6各自为氢或烷基，X为具有单电子对或双键的有机基团。 电子并且能够与金属配位。