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公开(公告)号：US20170268715A1
公开(公告)日：2017-09-21
申请号：US15617693
申请日：2017-06-08
发明人： Tsuyoki HIRAI , Kazutaka UEKADO
CPC分类号： F16L59/029 , B29C44/1233 , B29C44/588 , B29K2105/045 , B32B1/00 , B32B5/20 , B32B2266/0278 , B32B2307/304 , B32B2607/00 , C08J9/0009 , C08J2375/04 , F25D23/064 , F25D2201/1262 , Y10T428/233
摘要： A heat-insulating wall of the present invention includes: wall bodies (2 and 3) whose hollow portion is a heat-insulating space (10); gas circulation ports (5 and 6) which are disposed on the wall body and through which the heat-insulating space communicates with the outside; an open-cell urethane foam (4) of a thermosetting urethane resin with which the heat-insulating space is filled by integral foaming; and sealing materials (50, 51, 55, 60, 61 and 62) for sealing the gas circulation port.
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公开(公告)号：US20200009770A1
公开(公告)日：2020-01-09
申请号：US16573752
申请日：2019-09-17
发明人： Kazutaka UEKADO , Tsuyoki HIRAI
IPC分类号： B29C44/12 , B32B5/20 , B29C44/04 , B29C44/02 , B29C67/20 , B29C44/18 , E04C2/20 , F16L59/02 , F16L59/06 , C08J9/00 , F25D23/06 , E04B1/80
摘要： A heat-insulating housing (21) includes: a wall body; and an open-cell resin body (4) of thermosetting resin with which a heat-insulating space formed by the wall body is filled by integral foaming, the open-cell resin body including: a plurality of cells (47); a cell film portion (42); a cell skeleton portion (43); a first through-hole (44) formed so as to extend through the cell film portion; and a second through-hole (45) formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole.
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公开(公告)号：US20180306375A1
公开(公告)日：2018-10-25
申请号：US16016063
申请日：2018-06-22
发明人： Kazutaka UEKADO , Tsuyoki HIRAI
IPC分类号： F16L59/06 , C08J9/00 , E04C2/20 , B29C44/18 , F16L59/02 , F25D23/06 , E04B1/80 , B32B5/20 , B29K75/00 , B29K105/04 , B29L9/00 , B29L31/10
CPC分类号： B29C44/1276 , B29C44/02 , B29C44/022 , B29C44/0461 , B29C44/0469 , B29C44/1209 , B29C44/1214 , B29C44/18 , B29C67/20 , B29C67/202 , B29K2075/00 , B29K2105/045 , B29L2009/00 , B29L2031/10 , B32B5/20 , C08J9/0061 , C08J2205/05 , C08J2375/04 , C08J2423/06 , C08J2477/00 , E04B1/806 , E04C2/205 , F16L59/029 , F16L59/06 , F25D23/064 , F25D23/065 , F25D2201/1262 , Y10T428/1376 , Y10T428/231 , Y10T428/233
摘要： A heat-insulating housing (21) includes: a wall body; and an open-cell resin body (4) of thermosetting resin with which a heat-insulating space formed by the wall body is filled by integral foaming, the open-cell resin body including: a plurality of cells (47); a cell film portion (42); a cell skeleton portion (43); a first through-hole (44) formed so as to extend through the cell film portion; and a second through-hole (45) formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole.
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