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公开(公告)号:US20230311246A1
公开(公告)日:2023-10-05
申请号:US18019478
申请日:2021-05-26
Inventor: Akihisa MATSUMOTO , Takahiro OTA , Keita NAGATOSHI
IPC: B23K26/06 , B23K26/70 , B23K26/082
CPC classification number: B23K26/0648 , B23K26/702 , B23K26/082
Abstract: A laser processing head is provided with: an optical component for splitting a laser light into a laser light and a laser light; a scanning unit for scanning the laser light; a light reception unit for detecting the intensity of the laser light; a second shutter that shifts between a closed position in which the laser light is blocked and an open position in which the laser light is transmitted; and a focal distance adjustment unit for adjusting the focal distance of the laser light. The second shutter is arranged between the optical component and the focal distance adjustment unit.
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公开(公告)号:US20250010398A1
公开(公告)日:2025-01-09
申请号:US18706505
申请日:2022-09-13
Inventor: Keita NAGATOSHI
IPC: B23K26/062 , B23K26/064
Abstract: A laser processing device includes: a controller unit, a light source unit, and a head unit. The light source unit includes a laser light source, a light-source drive circuit, and a light-source control unit. The light-source control unit is configured so as to transmit a response signal in response to a request signal. The controller unit includes a light-source power circuit that supplies a light-source drive voltage to the light-source drive circuit. A main control unit of the controller unit: transmits the request signal; determines, on the basis of the received response signal, whether the light source unit can be driven; supplies the light-source drive voltage to the light-source drive circuit from the light-source power circuit in the case in which it is determined that the light source unit can be driven.
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公开(公告)号:US20220143746A1
公开(公告)日:2022-05-12
申请号:US17441425
申请日:2019-12-10
Inventor: Keita NAGATOSHI , Naoya YAMAZAKI , Akihisa MATSUMOTO , Hanfei LIU , Koichi WAKAKO
IPC: B23K26/064 , B23K26/082 , G02B26/10
Abstract: An oscillator unit has: a housing for housing a laser beam source and a laser beam source drive circuit; and connection portions connected to cables at a side of the housing, connection portions connected to cables at the side, and a connection portion connected to an optical fiber cable at the side.
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公开(公告)号:US20230278144A1
公开(公告)日:2023-09-07
申请号:US18019477
申请日:2021-05-26
Inventor: Akihisa MATSUMOTO , Takahiro OTA , Keita NAGATOSHI
IPC: B23K26/70 , B23K26/067 , B23K26/06
CPC classification number: B23K26/707 , B23K26/0673 , B23K26/0643
Abstract: A laser processing device comprises: a first shutter that shifts between a closed-state position for blocking a laser beam and an open-state position for allowing the laser beam to pass; a second shutter that shifts between a closed-state position for blocking laser beams and an open-state position for allowing the laser beams to pass; a first closed-state sensor that detects that the first shutter is disposed at the closed-state position; a first open-state sensor that detects that the first shutter is disposed at the open-state position; a second closed-state sensor that detects that the second shutter is disposed at the closed-state position; and a second open-state sensor that detects that the second shutter is disposed at the open-state position.
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