公开(公告)号：US11765824B2

公开(公告)日：2023-09-19

申请号：US17357159

申请日：2021-06-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Norimichi Noguchi ,  Masateru Mikami ,  Kenji Toyoshima ,  Hiroki Oda ,  Daisuke Suetsugu ,  Tatsuya Urakawa

IPC: H05K1/03 ,  H01C1/14 ,  H01C7/18 ,  H01C17/00 ,  H05K1/16 ,  C04B35/624 ,  C04B35/44 ,  B32B18/00 ,  C04B35/08 ,  C04B35/584 ,  C04B35/581 ,  C04B35/04

CPC classification number: H05K1/0306 ,  B32B18/00 ,  C04B35/44 ,  C04B35/624 ,  H01C1/14 ,  H01C7/18 ,  H01C17/006 ,  H05K1/167 ,  C04B35/04 ,  C04B35/08 ,  C04B35/581 ,  C04B35/584

Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

公开(公告)号：US11692958B2

公开(公告)日：2023-07-04

申请号：US17354925

申请日：2021-06-22

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shinya Suzuki ,  Kiyokazu Itoi ,  Daisuke Suetsugu ,  Norimichi Noguchi ,  Nobutoshi Takagi

IPC: G01N27/12 ,  G01N33/00

CPC classification number: G01N27/125 ,  G01N33/005

Abstract: A gas sensor device includes: a first electrode; a second electrode; a metal oxide layer that is disposed between the first electrode and the second electrode and is in contact with the first electrode and the second electrode; an interlayer insulating film that covers a part of the first electrode, a part of the second electrode, and a part of the metal oxide layer; and a hydrogen permeable film that allows only hydrogen to permeate, a local region that is in contact with the second electrode is provided inside the metal oxide layer, the local region having a higher oxygen deficiency than an oxygen deficiency of the other region in the metal oxide layer, an opening that exposes a gas contact portion which is a part of a main surface of the second electrode is provided in the interlayer insulating film, and the hydrogen permeable film is provided to cover at least the gas contact portion.

公开(公告)号：US11626218B2

公开(公告)日：2023-04-11

申请号：US17354895

申请日：2021-06-22

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masateru Mikami ,  Daisuke Suetsugu ,  Norimichi Noguchi

IPC: H01C1/01 ,  H01C7/00

Abstract: The laminated alumina board for an electronic device includes an alumina board that is made of a sintered body of alumina particles and has an unevenness structure that is formed of the alumina particles on a surface and a flattening film that is provided on an upper surface of the alumina board and contains alumina as a main component.