公开(公告)号：US20180168034A1

公开(公告)日：2018-06-14

申请号：US15577011

申请日：2016-06-22

Applicant: Panasonic Intellectual Property Management Co. Ltd.

Inventor： RYOSUKE MESHII ,  KAZUO GODA ,  TAKAHIRO SHINOHARA ,  TAKANORI AOYAGI ,  KENSAKU YAMAMOTO ,  HITOSHI YOSHIDA

IPC: H05K1/02 ,  H05K1/03 ,  G01P15/125

CPC classification number: H05K1/0298 ,  B81B7/007 ,  B81B7/0074 ,  B81B2207/092 ,  B81B2207/096 ,  G01P1/00 ,  G01P15/08 ,  G01P15/125 ,  H05K1/0306

Abstract: A wiring-buried glass substrate includes a glass substrate and a first wiring. The glass substrate includes a first surface, a second surface perpendicular to the first surface, and a third surface facing the first surface. The first wiring includes a first pillar portion and a first beam portion. The first pillar portion extends in a first direction perpendicular to the first surface of the glass substrate. The first beam portion is connected to a first surface of the first pillar portion and extends to a second direction perpendicular to a second surface of the glass substrate. The first wiring is buried in the glass substrate. The first surface of the first beam portion is exposed from a third surface of the glass substrate.

公开(公告)号：US20190137387A1

公开(公告)日：2019-05-09

申请号：US16096287

申请日：2017-05-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MASAHIKO OHBAYASHI ,  KOJI SAKAI ,  RYOSUKE MESHII ,  SHINICHI KISHIMOTO ,  AKIRA MATSUURA

IPC: G01N21/3504 ,  G01N21/03 ,  G01N21/552

Abstract: An object of the present disclosure is to provide a device that can be manufactured in a simple process while ensuring a reduction in influence of noise on an electronic component. A device according to the present disclosure, accomplished to fulfill the object, includes light emitting element, light receiving element, electronic component to process signals sent from light receiving element, and optical component cover light emitting element and light receiving element. The device further includes reflector cover a lower surface of optical component and substrate. Reflector has first opening directly above light emitting element and second opening directly above light receiving element. Light emitting element, light receiving element, reflector, electronic component, and optical component are mounted over substrate. Reflector is electrically connected to substrate by a member disposed between reflector and substrate.