公开(公告)号：US20160133362A1

公开(公告)日：2016-05-12

申请号：US14997459

申请日：2016-01-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SEIJI TSUDA ,  SHOGO NAKAYAMA ,  TAKESHI ISEKI ,  KAZUTOSHI MATSUMURA

IPC: H01C1/14 ,  G03F7/40 ,  H01C17/06 ,  H01C17/00 ,  H01C17/28 ,  H01C17/24

CPC classification number: H01C1/14 ,  G03F7/40 ,  H01C7/003 ,  H01C17/003 ,  H01C17/06 ,  H01C17/065 ,  H01C17/24 ,  H01C17/28 ,  H01C17/281

Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

Abstract translation: 电阻器包括电阻元件，保护膜和一对电极。 电阻元件由金属板制成。 保护膜形成在电阻元件的上表面上。 形成电镀层以覆盖电极。 电极之间保护膜彼此分离，并形成在电阻元件的上表面的两端。 电极通过印刷含金属浆料形成。

公开(公告)号：US20200090839A1

公开(公告)日：2020-03-19

申请号：US16341094

申请日：2018-01-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOICHI YAMADA ,  SHOGO NAKAYAMA

IPC: H01C1/142 ,  H01C7/00 ,  H01C17/28

Abstract: A chip resistor having a predetermined resistance value is manufactured by the following method. A resistive element is provided on an upper surface of an insulating substrate. The resistive element includes a wide portion, a first narrow portion extending from the wide portion, and a part extending from the wide portion, the first narrow portion has a smaller width than the wide portion. First and second electrodes are provided on the upper surface of the insulating substrate. The first electrode is located away from the wide portion. The first electrode contacts the first narrow portion. The first electrode overlaps the first narrow portion when viewed from above. The second electrode contacts the part of the resistive element. The second electrode overlaps the part of the resistive element when viewed from above. A distance between the narrow portion and the wide portion is determined so as to cause a resistance value between the first and second electrodes to be the predetermined resistance value. This method improves the precision of the resistance value of the chip resistor.

公开(公告)号：US20170365380A1

公开(公告)日：2017-12-21

申请号：US15527319

申请日：2016-12-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NAOHIRO MIKAMOTO ,  FUYUKI ABE ,  YUJI YASUOKA ,  AKIMITSU FUJII ,  SHOGO NAKAYAMA ,  TAKESHI ISEKI

IPC: H01C1/084 ,  H01C1/14 ,  G01R1/20 ,  H01C1/028 ,  H01C7/06 ,  H01C7/00

CPC classification number: H01C1/084 ,  G01R1/203 ,  H01C1/028 ,  H01C1/032 ,  H01C1/14 ,  H01C7/003 ,  H01C7/06

Abstract: A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

公开(公告)号：US20170040091A1

公开(公告)日：2017-02-09

申请号：US15303731

申请日：2015-03-30

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SHOGO NAKAYAMA

IPC: H01C1/032 ,  H01C7/00 ,  H01C1/148 ,  H01C17/00

CPC classification number: H01C1/032 ,  H01C1/028 ,  H01C1/142 ,  H01C1/148 ,  H01C7/00 ,  H01C7/003 ,  H01C17/006 ,  H01C17/02 ,  H01C17/281

Abstract: A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

Abstract translation: 片状电阻器包括绝缘衬底，设置在绝缘衬底的上表面上的电阻元件，设置在电阻元件的上表面的两个端部中的相应的上表面电极上的一对上表面电极，以暴露部件 电阻元件的上表面的上表面电极，以及覆盖电阻元件的一部分并且不覆盖一对上表面电极的保护层。 一对上表面电极分别具有暴露的上表面和暴露的边缘表面。 一对上表面电极的每个边缘表面不从绝缘基板的各个边缘表面向外突出。 芯片电阻可以降低电阻的温度系数，提高电阻的温度系数。