Abstract:
A nonvolatile memory device includes: a pair of first wirings extending in a first direction; a second wiring extending in a second direction crossing the first direction; a pair of third wirings extending in the second direction; and a fourth wiring located between the pair of the third wirings. The nonvolatile memory device has four resistance-change elements each which is provided adjacent to respective four crossing areas in which each of the pair of first wirings intersects with each of the pair of third wirings, and a first contact plug disposed at an intersection of two diagonals of a virtual tetragon defined by the four resistance-change elements. Two transistors arranged in the second direction, among four transistors, share each one first main terminal located between the pair of the first wirings, the shared each one first main terminal being connected to the second wiring.
Abstract:
A nonvolatile memory device includes a plurality of nonvolatile memory elements each having an upper electrode, a variable resistance layer, and a lower electrode; a first insulating layer embedding the plurality of nonvolatile memory elements, and ranging from a lowermost part of the lower electrode to a position higher than an uppermost part of the upper electrode in each of the nonvolatile memory elements; a second insulating layer being formed on the first insulating layer, and having an average size of vacancies larger than an average size of vacancies included in the first insulating layer, or having an average carbon concentration higher than an average carbon concentration of the first insulating layer; and a conductive layer penetrating the second insulating layer and a part of the first insulating layer and being connected to at least one of the upper electrodes included in the nonvolatile memory elements.
Abstract:
A non-volatile memory device comprises first wires on and above a first plane; second wires extending in a direction crossing the first wires, on and above a second plane, third wires extending in parallel with the second wires on and above a fourth plane, and memory cells provided to correspond to three-dimensional cross-points of the first wires and the third wires, respectively, each of the memory cells including a transistor and a variable resistance element, the transistor including a first main electrode, a second main electrode, and a control electrode, the variable resistance element being placed on and above a third plane and including a lower electrode, an upper electrode and a variable resistance layer, wherein the upper electrode is connected to corresponding one of the third wires; and further comprises a first contact plug extending from the first main electrode to the second plane and connected to corresponding one of the second wires; a second contact plug extending from the second main electrode to the second plane; and a third contact plug extending from the second contact plug and connected to the lower electrode; wherein the second main electrode and the lower electrode are connected to each other via the second contact plug and the third contact plug.