公开(公告)号：US20190181081A1

公开(公告)日：2019-06-13

申请号：US16275957

申请日：2019-02-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroki TAMIYA ,  Koji KISHINO ,  Ryuji TAKAHASHI ,  Yasunori HOSHINO ,  Takahiro YAMADA ,  Shimpei OBATA ,  Hiroyuki SHIRAKI ,  Shinya ARAKAWA ,  Shigetoshi FUJITA

IPC: H01L23/498 ,  C08L63/00 ,  H01L23/14 ,  C08K9/04

Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.