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1.发明申请RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE 审中-公开印刷线路板，PREPREG和金属层压板的树脂组合物公开(公告)号：US20160017141A1
公开(公告)日：2016-01-21
申请号：US14771487
申请日：2014-02-27
Inventor： Masaaki MATSUMOTO , Yasunori HOSHINO , Tatsuo YONEMOTO
Abstract: Provided is a resin composition for a printed wiring board with which a substrate material having a low CTE can be formed while ensuring good moldability. A resin composition for a printed wiring board contains a thermosetting resin including an epoxy resin, a curing agent, an inorganic filler, and an expansion relief component including an acrylic resin that is soluble in an organic solvent. The content of the inorganic filler is 150 parts by mass or more with respect to 100 parts by mass of the total amount of the thermosetting resin and the curing agent. The melt viscosity at 130° C. is less than 50000 Ps.
Abstract translation: 提供一种用于印刷线路板的树脂组合物，其中可以形成具有低CTE的基材，同时确保良好的成型性。 用于印刷电路板的树脂组合物含有包含环氧树脂，固化剂，无机填料和包含可溶于有机溶剂的丙烯酸树脂的膨胀释放组分的热固性树脂。 相对于100质量份的热固性树脂和固化剂的总量，无机填料的含量为150质量份以上。 130℃下的熔体粘度小于50000 Ps。
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公开(公告)号：US20250109233A1
公开(公告)日：2025-04-03
申请号：US18720260
申请日：2022-10-13
Inventor： Yasunori HOSHINO , Mikio SATO , Yuki KITAI
IPC: C08F283/08 , C08F112/36 , C08J5/24 , C08K3/36 , C08K3/38 , C08K5/14 , C08K5/3492 , C08L79/08
Abstract: An aspect of the present invention relates to a resin composition containing a radical polymerizable compound (A), an inorganic filler (B) containing boron nitride (B-1) and silica (B-2), and a free radical compound (C) having at least one free radical group selected from the group consisting of structures represented by Formulas (1), (2), (3) and (4) in the molecule.
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公开(公告)号：US20220289969A1
公开(公告)日：2022-09-15
申请号：US17632721
申请日：2020-07-30
Inventor： Masashi KODA , Yuki KITAI , Atsushi WADA , Yasunori HOSHINO
Abstract: An aspect of the present invention is a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less.
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公开(公告)号：US20200223998A1
公开(公告)日：2020-07-16
申请号：US16651069
申请日：2018-09-28
Inventor： Yasunori HOSHINO , Hiroaki FUJIWARA , Yuki KITAI , Takayoshi OZEKI , Mikio SATO , Masashi KODA
Abstract: One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resin composition contains (A) a thermosetting resin containing a modified polyphenylene ether compound, (B) a first inorganic filler in which a molybdenum compound is present on at least a part of the surface, and (C) a second inorganic filler, a content of (B) the first inorganic filler is 0.1 parts by weight or more and 15 parts by weight or less, and a content of (C) the second inorganic filler is 200 parts by mass or less, with respect to 100 parts by weight of (A) the thermosetting resin, and the fibrous base material is a glass cloth containing quartz glass yarn.
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公开(公告)号：US20190181081A1
公开(公告)日：2019-06-13
申请号：US16275957
申请日：2019-02-14
Inventor： Hiroki TAMIYA , Koji KISHINO , Ryuji TAKAHASHI , Yasunori HOSHINO , Takahiro YAMADA , Shimpei OBATA , Hiroyuki SHIRAKI , Shinya ARAKAWA , Shigetoshi FUJITA
IPC: H01L23/498 , C08L63/00 , H01L23/14 , C08K9/04
Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.
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Patent Agency Ranking
公开(公告)号：US20190150279A1
公开(公告)日：2019-05-16
申请号：US16095120
申请日：2017-04-18
Inventor： Shimpei OBATA , Ryuuji TAKAHASHI , Yasunori HOSHINO , Shigetoshi FUJITA
IPC: H05K1/03 , B32B15/08 , H05K1/02 , H01L23/498 , C08J5/24
Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.
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7.发明公开公开(公告)号：US20230272213A1
公开(公告)日：2023-08-31
申请号：US18015882
申请日：2021-07-13
Inventor： Yasunori HOSHINO , Yuki KITAI , Mikio SATO
CPC classification number: C08L71/12 , C08K3/36 , C08K5/16 , C08K3/22 , C08J5/24 , C08J7/0427 , H05K1/0373 , C08K2003/385
Abstract: A resin composition includes: a polyphenylene ether compound having at least one of groups expressed by formulas (1) and (2), a curing agent reactable with the polyphenylene ether compound, a styrene-based polymer having structural units expressed by formulas (3) and (4); and an inorganic filler containing boron nitride, wherein a content of the inorganic filler is 100 to 320 parts by mass relative to 100 parts by mass of a total of the polyphenylene ether compound, the curing agent, and the styrene-based polymer.
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公开(公告)号：US20220159830A1
公开(公告)日：2022-05-19
申请号：US17440528
申请日：2020-03-26
Inventor： Yasunori HOSHINO , Yuki KITAI , Atsushi WADA , Masashi KODA , Mikio SATO
Abstract: A prepreg includes: a resin composition or a semi-cured product thereof; and a fibrous base material, wherein the resin composition contains a polymer having a structural unit expressed by the formula (1) in a molecule, and a curing agent each at a predetermined content rate. A cured product of the resin composition has a Dk of 2.6 to 3.8, and the fibrous base material includes a glass cloth having a Dk of 4.7 or less and a Df of 0.0033 or less. A cured product of the prepreg has a Dk of 2.7 to 3.8, and a Df of 0.002 or less. In the formula (1), Z represents an arylene group, R1 to R3 each independently represents a hydrogen atom or an alkyl group, and R4 to R6 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
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公开(公告)号：US20220106426A1
公开(公告)日：2022-04-07
申请号：US17426400
申请日：2019-12-18
Inventor： Yuki KITAI , Masashi KODA , Yasunori HOSHINO , Atsushi WADA , Mikio SATO
Abstract: A copper-clad laminate includes an insulating layer formed of a cured product of a resin composition and a surface treated copper foil in contact with the insulating layer, in which the resin composition contains a compound having at least one group specified in the present application and a crosslinking type curing agent; and the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil.
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10.发明申请公开(公告)号：US20210269595A1
公开(公告)日：2021-09-02
申请号：US17256382
申请日：2019-07-09
Inventor： Mikio SATO , Yuki KITAI , Yasunori HOSHINO , Masashi KODA , Atsushi WADA
IPC: C08G65/48 , C08J5/24 , C08F290/06 , H05K1/03
Abstract: An aspect of the present invention is a resin composition containing a compound (A) having at least one group represented by the following Formula (1) in a molecule and an acenaphthylene compound (B). In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
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