公开(公告)号：US20250136741A1

公开(公告)日：2025-05-01

申请号：US18703589

申请日：2022-10-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuji YAMADA ,  Eiichiro SAITO ,  Hiroyuki FUJISAWA ,  Takahiro YAMADA

IPC: C08F290/06 ,  B32B15/08 ,  C08F290/04 ,  C08K3/36 ,  C08K5/3415 ,  C08K9/04

Abstract: The present disclosure provides a thermosetting resin composition contributing to reducing the elastic modulus of a cured product and increasing the flexibility thereof while reducing the chances of causing a decline in the heat resistance of the cured product. A thermosetting resin composition contains: a maleimide compound (A) having at least two maleimide groups in one molecule; a compound (B) having, at either or both of terminals thereof, a substituent with an ethylenic unsaturated bond and having a polyphenylene ether skeleton; and an inorganic filler (C). The compound (B) includes a compound (B1) having a butadiene-derived structural unit.

公开(公告)号：US20220363798A1

公开(公告)日：2022-11-17

申请号：US17621148

申请日：2020-06-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takahiro YAMADA ,  Hiroyuki FUJISAWA ,  Yuji YAMADA

IPC: C08F290/06 ,  C08G65/38 ,  C08G61/10 ,  C08K5/3415 ,  C08K5/3492 ,  C08K5/13 ,  C08F222/10 ,  C08K5/5397 ,  C08K5/5313 ,  C08J5/24 ,  B32B15/08 ,  B32B27/26

Abstract: A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent. In Formula (1), R1 represents a hydrogen atom or an alkyl group.

公开(公告)号：US20190181081A1

公开(公告)日：2019-06-13

申请号：US16275957

申请日：2019-02-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroki TAMIYA ,  Koji KISHINO ,  Ryuji TAKAHASHI ,  Yasunori HOSHINO ,  Takahiro YAMADA ,  Shimpei OBATA ,  Hiroyuki SHIRAKI ,  Shinya ARAKAWA ,  Shigetoshi FUJITA

IPC: H01L23/498 ,  C08L63/00 ,  H01L23/14 ,  C08K9/04

Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.

公开(公告)号：US20170097789A1

公开(公告)日：2017-04-06

申请号：US15277804

申请日：2016-09-27

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Toshiaki TAKASU ,  Takahiro YAMADA ,  Kenichi TANAKA ,  Hirotaka ENDOU ,  Kouretsu BOKU

IPC: G06F3/06

CPC classification number: G06F3/0677 ,  G06F3/0604 ,  G06F3/0643 ,  G06F3/0652

Abstract: An information recording device including a controller records information in a write-once optical disk group including one or a plurality of write-once optical disks. When recording new data, the controller calculates a residual quantity of an alternate area. The calculation of the residual quantity of the alternate area corresponds to a subtraction of a first consumption size and a second consumption size from a size of the alternate area of the write-once optical disk group. The first consumption size is a size of the alternate area already consumed when the data recorded in the write-once optical disk group was erased. The second consumption size is an estimated size of the alternate area to be consumed when the data recorded in the write-once optical disk group is erased. The controller records the new data when the residual quantity is greater than or equal to a third consumption size.