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公开(公告)号：US11312858B2
公开(公告)日：2022-04-26
申请号：US16629829
申请日：2018-06-22
Inventor： Tatsuya Arisawa , Fumito Suzuki , Shunji Araki , Hirohisa Goto , Yuki Inoue
IPC: C08L71/12 , B32B15/08 , C08J5/04 , C08J5/18 , C08J5/24 , C08K3/36 , C08K5/00 , C08K5/3492 , C08K5/5399 , C08K5/544
Abstract: Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.
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公开(公告)号：US11267225B2
公开(公告)日：2022-03-08
申请号：US16071071
申请日：2016-12-12
Inventor： Tatsuya Arisawa , Tomoyuki Abe , Shunji Araki , Yuki Inoue
IPC: B32B15/092 , B32B37/18 , H05K1/03 , H05K1/09 , B32B15/08
Abstract: A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 μmol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz.
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