公开(公告)号：US11078361B2

公开(公告)日：2021-08-03

申请号：US16332259

申请日：2017-10-10

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tatsuya Arisawa ,  Hirohisa Goto ,  Tomoyuki Abe

IPC: C08L71/12 ,  C08L63/04 ,  C08G65/332 ,  C08J5/24 ,  C08G59/06 ,  C08G59/40 ,  H05K1/03 ,  B32B15/08 ,  C08F290/06 ,  C08G59/68 ,  B32B27/00 ,  C08J5/10 ,  C08L101/00 ,  C08K5/3492 ,  C08L63/00 ,  C08K5/49 ,  C08K5/5313 ,  C08K5/00 ,  C08K5/5399

Abstract: One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.

公开(公告)号：US09775239B2

公开(公告)日：2017-09-26

申请号：US15128093

申请日：2015-04-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tatsuya Arisawa ,  Yoshihiko Nakamura ,  Tomoyuki Abe ,  Kiyotaka Komori ,  Syouji Hasimoto ,  Mitsuyoshi Nishino

IPC: H05K1/00 ,  H05K1/03 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  H05K3/00 ,  C08J5/10

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B27/20 ,  B32B2305/076 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2371/12 ,  H05K1/0366 ,  H05K3/0067 ,  H05K2201/0209 ,  H05K2201/0215

Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

公开(公告)号：US11330710B2

公开(公告)日：2022-05-10

申请号：US16603067

申请日：2018-02-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tatsuya Arisawa ,  Hirohisa Goto ,  Tomoyuki Abe

IPC: H05K1/03 ,  H05K1/09 ,  B32B15/14 ,  C08F290/06 ,  H05K1/02

Abstract: A metal-clad laminated board includes an insulating layer and a metal layer, in which the insulating layer includes a cured product of a resin composition containing a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated double bond; and a crosslinkable curing agent having an unsaturated double bond in the molecule, and containing 40 to 250 parts by mass of silica particles with respect to 100 parts by mass in total of the modified polyphenylene ether compound and the crosslinkable curing agent, the resin composition contains 0.2 to 5 parts by mass of a first silane coupling agent having an unsaturated double bond in the molecule with respect to 100 parts by mass of the silica particles, and a contact surface of the metal layer in contact with the insulating layer is surface-treated with a second silane coupling agent having an amino group in the molecule.

公开(公告)号：US11267225B2

公开(公告)日：2022-03-08

申请号：US16071071

申请日：2016-12-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tatsuya Arisawa ,  Tomoyuki Abe ,  Shunji Araki ,  Yuki Inoue

IPC: B32B15/092 ,  B32B37/18 ,  H05K1/03 ,  H05K1/09 ,  B32B15/08

Abstract: A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 μmol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz.