公开(公告)号：US09786472B2

公开(公告)日：2017-10-10

申请号：US14873255

申请日：2015-10-02

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tetsuhiro Iwai ,  Shogo Okita ,  Syouzou Watanabe

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/50 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  C23C16/46

CPC classification number: H01J37/3244 ,  C23C16/4586 ,  C23C16/466 ,  C23C16/50 ,  H01J37/321 ,  H01J37/32724 ,  H01L21/67109 ,  H01L21/67132 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68785

Abstract: A plasma processing apparatus performs plasma processing on a substrate held by a carrier. The carrier includes a frame disposed around the substrate and a holding sheet which holds the substrate and the frame. The plasma processing apparatus includes: a chamber; a stage which is disposed within the chamber and has an upper surface on which the carrier is mounted; a gas hole which is provided at a position of the upper surface opposing a bottom surface of the frame and through which cooling gas is supplied between the stage and the carrier; and a plasma exciting unit which generates plasma within the chamber.

公开(公告)号：US09779986B2

公开(公告)日：2017-10-03

申请号：US15245139

申请日：2016-08-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Atsushi Harikai ,  Noriyuki Matsubara ,  Hideo Kanou ,  Mitsuru Hiroshima ,  Syouzou Watanabe ,  Toshihiro Wada

IPC: H01L21/78 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/768

CPC classification number: H01L21/76826 ,  H01L21/78

Abstract: Provided is a plasma treatment method including: placing a substrate carrier holding a substrate on a stage; adjusting a distance between a cover and the stage to a first distance in which the cover covers a frame without coming into contact with the substrate carrier; performing a plasma treatment on the substrate placed on the stage after the adjusting of the distance; carrying the substrate together with the substrate carrier out from a reaction chamber after the performing of the plasma treatment; and removing an adhered substance adhered to the cover by generating plasma in the inside of the reaction chamber after the carrying of the substrate, in which the distance between the cover and the stage in the removing of the adhered substance is a second distance greater than the first distance.