公开(公告)号：US20240161948A1

公开(公告)日：2024-05-16

申请号：US18255989

申请日：2021-12-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi OHBAYASHI ,  Junko ONOZAKI ,  Hirokatsu ITO ,  Kyousuke ISONO

IPC: H01C1/02 ,  C09D7/40 ,  C09D7/61 ,  C09D7/65 ,  C09D163/04

CPC classification number: H01C1/02 ,  C09D7/61 ,  C09D7/65 ,  C09D7/69 ,  C09D163/04

Abstract: A chip resistor includes: a resistor body; and a protective coating that covers the resistor body. The protective coating is a cured product of a coating agent containing a polyfunctional epoxy resin, a curing agent, an inorganic filler, and silicone rubber particles. The coating agent contains: silica as the inorganic filler at a content equal to or greater than 60% by weight and equal to or less than 90% by weight; and the silicone rubber particles at a content equal to or greater than 1% by weight and equal to or less than 15% by weight.

公开(公告)号：US20200011507A1

公开(公告)日：2020-01-09

申请号：US16483874

申请日：2018-02-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshihisa NAGASAKI ,  Takashi OHBAYASHI ,  Takahiro HAMADA ,  Yukihiko SUGIO ,  Yusuke OGIHARA

IPC: F21V9/30 ,  F21S41/16 ,  F21S41/176

Abstract: A wavelength conversion member of the present disclosure includes a first matrix, phosphor particles embedded in the first matrix, and at least one selected from the group consisting of first filler particles embedded in the first matrix and surface coating layers respectively covering surfaces of the phosphor particles. The wavelength conversion member satisfies at least one relationship selected from the group consisting of |n3−n1|>|n1−n2| and |n4−n1|>|n1−n2| wherein n1 is a refractive index of the first matrix, n2 is a refractive index of the phosphor particles, n3 is a refractive index of the first filler particles, and n4 is a refractive index of the surface coating layers.

公开(公告)号：US20210102117A1

公开(公告)日：2021-04-08

申请号：US16635456

申请日：2018-08-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takahiro HAMADA ,  Yukihiko SUGIO ,  Takashi OHBAYASHI ,  Yoshihisa NAGASAKI

IPC: C09K11/02 ,  F21V9/30 ,  F21V7/06 ,  F21V9/08 ,  C30B28/04 ,  C30B29/16 ,  C09K11/77 ,  C01F7/02

Abstract: A wavelength conversion device of the present disclosure includes a substrate, a phosphor layer that has a matrix containing zinc oxide and phosphor particles embedded in the matrix and that is supported by the substrate, a dielectric layer disposed between the substrate and the phosphor layer, and a protective layer that is disposed between the phosphor layer and the dielectric layer and that has an isoelectric point equal to or larger than 7. A main surface of the substrate includes, for example, first and second regions. The phosphor layer covers, for example, only the first region out of the first and second regions.

公开(公告)号：US20240355512A1

公开(公告)日：2024-10-24

申请号：US18684148

申请日：2022-08-10

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuki AOIKE ,  Hirokatsu ITO ,  Kenichi MATSUSHIMA ,  Shogo NAKAYAMA ,  Tomohiro FUJITA ,  Takashi OHBAYASHI

IPC: H01C7/06 ,  H01C17/00 ,  H01C17/065

CPC classification number: H01C7/06 ,  H01C17/006 ,  H01C17/06526 ,  H01C17/06546 ,  H01C17/06586

Abstract: A resistive paste according to the present disclosure includes metal particles, insulating particles, glass particles, and a metal silicide. The metal particles include copper and nickel. The insulating particles include at least one of alumina, zirconia, zinc oxide, or boron nitride. A chip resistor according to the present disclosure includes a resistive element and a substrate. The resistive element includes the resistive paste as a material and is disposed on the substrate.

公开(公告)号：US20220100068A1

公开(公告)日：2022-03-31

申请号：US17426329

申请日：2019-10-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshihisa NAGASAKI ,  Takashi OHBAYASHI ,  Naoyuki TANI ,  Nobuyasu SUZUKI ,  Takahiro HAMADA ,  Yukihiko SUGIO

IPC: G03B21/20 ,  G03B21/16 ,  C09K11/02 ,  C09K11/77 ,  C09K5/14

Abstract: Provided is a technique for suppressing a temperature rise of a wavelength conversion member. The present disclosure is provided with: phosphor layer containing a phosphor; substrate that supports phosphor layer; and heat sink bonded to substrate, wherein the thermal conductivity of substrate is greater than the thermal conductivity of phosphor layer, and the thermal conductivity of heat sink is greater than the thermal conductivity of substrate, or the thermal conductivity of heat sink is smaller than the thermal conductivity of substrate.

公开(公告)号：US20220057702A1

公开(公告)日：2022-02-24

申请号：US17414401

申请日：2019-10-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takahiro HAMADA ,  Naoyuki TANI ,  Takashi OHBAYASHI ,  Yoshihisa NAGASAKI

IPC: G03B21/20 ,  C09K11/02 ,  C09K11/77

Abstract: A wavelength conversion device includes a matrix containing inorganic material, a phosphor embedded in the matrix, and filler particles embedded in the matrix and containing resin material. This wavelength conversion device prevents the phosphor from falling.