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公开(公告)号:US10785430B2
公开(公告)日:2020-09-22
申请号:US16059485
申请日:2018-08-09
Inventor: Makoto Ikuma , Takahiro Muroshima , Takayasu Kito , Hiroyuki Amikawa , Tetsuya Abe
Abstract: A solid-state imaging device includes: a pixel including a photoelectric converter that generates a charge and a charge accumulator that converts the charge into a voltage; a controller that causes the pixel to perform exposure in a first exposure mode and convert the charge into the voltage with a first gain to output a first pixel signal, and causes the pixel to perform exposure in a second exposure mode and convert the charge into the voltage with a second gain to output a second pixel signal, the second exposure mode being shorter in exposure time than the first exposure mode, and the second gain being lower than the first gain; and a signal processor that synthesizes the second pixel signal after amplification and the first pixel signal.
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公开(公告)号:US20190289238A1
公开(公告)日:2019-09-19
申请号:US16431302
申请日:2019-06-04
Inventor: Makoto IKUMA , Hiroyuki Amikawa , Takayasu Kito , Shinichi Ogita , Junichi Matsuo , Yasuyuki Endoh , Katsumi Tokuyama , Tetsuya Abe
Abstract: A solid-state imaging apparatus includes a pixel array, a column processor, and a test signal generating circuit that generates a first digital signal for testing purposes. The test signal generating circuit generates the first digital signal within one horizontal scanning period. The column processor converts a first analog signal, that is converted from the first digital signal, to a second digital signal within the one horizontal scanning period.
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公开(公告)号:US10685997B2
公开(公告)日:2020-06-16
申请号:US16431302
申请日:2019-06-04
Inventor: Makoto Ikuma , Hiroyuki Amikawa , Takayasu Kito , Shinichi Ogita , Junichi Matsuo , Yasuyuki Endoh , Katsumi Tokuyama , Tetsuya Abe
IPC: H04N5/378 , H01L27/146 , H01L27/142 , H04N5/225 , H04N5/232 , H04N5/235 , H04N5/363 , H04N17/00 , H04N5/355 , H04N5/353 , B60R11/04 , B60R11/00
Abstract: A solid-state imaging apparatus includes a pixel array, a column processor, and a test signal generating circuit that generates a first digital signal for testing purposes. The test signal generating circuit generates the first digital signal within one horizontal scanning period. The column processor converts a first analog signal, that is converted from the first digital signal, to a second digital signal within the one horizontal scanning period.
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公开(公告)号:US10742906B2
公开(公告)日:2020-08-11
申请号:US16059517
申请日:2018-08-09
Inventor: Makoto Ikuma , Takahiro Muroshima , Takayasu Kito , Hiroyuki Amikawa , Tetsuya Abe
IPC: H04N5/335 , H04N5/345 , H01L27/146 , H04N5/357 , H04N5/378 , H03M1/08 , H04N5/369 , H04N5/3745 , H03M1/56 , H03M1/12
Abstract: A solid-state imaging device includes: a pixel array unit in which a plurality of pixels are arranged in rows and columns; a plurality of column signal lines which are provided in one-to-one correspondence with pixel columns; a column processor including a plurality of column AD circuits provided in one-to-one correspondence with the plurality of column signal lines; a power supply variation detector which is connected to a power supply wire through which a power supply voltage is transmitted to each of the pixels, and which detects, in correspondence with pixel rows, power supply variation components attributed to variations in the power supply voltage; and a power supply variation corrector which corrects, for each of the pixel rows, a pixel signal detected by the column processor, using the power supply variation components detected by the power supply variation detector.
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