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公开(公告)号:US12094895B2
公开(公告)日:2024-09-17
申请号:US17838911
申请日:2022-06-13
Inventor: Junji Hirase , Yoshihiro Sato , Yasuyuki Endoh , Hiroyuki Amikawa
IPC: H01L27/146 , H01L27/02 , H04N25/57 , H04N25/75 , H04N25/76
CPC classification number: H01L27/1461 , H01L27/0288 , H01L27/14603 , H01L27/14636 , H01L27/14643 , H04N25/57 , H04N25/75 , H04N25/76
Abstract: An imaging device having a semiconductor substrate including: a semiconductor region including an impurity of a first conductivity type, a first diffusion region that is in contact with the semiconductor region, that includes an impurity of a second conductivity type different from the first conductivity type, and that converts incident light into charges, and a second diffusion region that includes an impurity of the second conductivity type and that directly accumulates at least a part of the charges generated in the first diffusion region. The imaging device further includes a contact plug in contact with the second diffusion region, and a capacitive element electrically connected to the second diffusion region through the contact plug.
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公开(公告)号:US10685997B2
公开(公告)日:2020-06-16
申请号:US16431302
申请日:2019-06-04
Inventor: Makoto Ikuma , Hiroyuki Amikawa , Takayasu Kito , Shinichi Ogita , Junichi Matsuo , Yasuyuki Endoh , Katsumi Tokuyama , Tetsuya Abe
IPC: H04N5/378 , H01L27/146 , H01L27/142 , H04N5/225 , H04N5/232 , H04N5/235 , H04N5/363 , H04N17/00 , H04N5/355 , H04N5/353 , B60R11/04 , B60R11/00
Abstract: A solid-state imaging apparatus includes a pixel array, a column processor, and a test signal generating circuit that generates a first digital signal for testing purposes. The test signal generating circuit generates the first digital signal within one horizontal scanning period. The column processor converts a first analog signal, that is converted from the first digital signal, to a second digital signal within the one horizontal scanning period.
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公开(公告)号:US11527560B2
公开(公告)日:2022-12-13
申请号:US17067151
申请日:2020-10-09
Inventor: Yuuko Tomekawa , Takahiro Koyanagi , Hiroyuki Amikawa , Yasuyuki Endoh
IPC: H01L27/146
Abstract: An imaging device includes: a semiconductor substrate; a first photoelectric converter which is disposed in the semiconductor substrate; a second photoelectric converter different from the first photoelectric converter, which is disposed in the semiconductor substrate; a wiring layer disposed on or above the semiconductor substrate; and a capacitor which is disposed in the wiring layer and surrounds the first photoelectric converter in plan view. The capacitor includes a first electrode, a second electrode, and a dielectric layer disposed between the first electrode and the second electrode. The first electrode is connected to one of the first photoelectric converter and the second photoelectric converter.
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公开(公告)号:US20190289238A1
公开(公告)日:2019-09-19
申请号:US16431302
申请日:2019-06-04
Inventor: Makoto IKUMA , Hiroyuki Amikawa , Takayasu Kito , Shinichi Ogita , Junichi Matsuo , Yasuyuki Endoh , Katsumi Tokuyama , Tetsuya Abe
Abstract: A solid-state imaging apparatus includes a pixel array, a column processor, and a test signal generating circuit that generates a first digital signal for testing purposes. The test signal generating circuit generates the first digital signal within one horizontal scanning period. The column processor converts a first analog signal, that is converted from the first digital signal, to a second digital signal within the one horizontal scanning period.
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