公开(公告)号：US20210121992A1

公开(公告)日：2021-04-29

申请号：US17073466

申请日：2020-10-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NAOMICHI OHASHI ,  YASUHIRO OKAWA ,  KOSO MATSUNO

IPC: B23K35/362 ,  B23K35/36

Abstract: A solder paste containing a solder powder and a flux, in which the flux contains a keto acid and a hydroxy group-containing compound different from the keto acid, and the keto acid has a melting point of 60° C. or lower, the hydroxy group-containing compound has a melting point of 60° C. or lower and has at least three hydroxy groups in the molecule, and a content of the keto acid, a content of the hydroxy group-containing compound and a content of the solder powder satisfy Expressions (1) and (2), W1×⅓≤W2≤W1×⅚  (1) (W1+W2)/W3×100≥2.0  (2) where W1 represents a weight (g) of the keto acid, W2 represents a weight (g) of the hydroxy group-containing compound, and W3 represents a weight (g) of the solder powder.

公开(公告)号：US20210129273A1

公开(公告)日：2021-05-06

申请号：US17073461

申请日：2020-10-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NAOMICHI OHASHI ,  KOSO MATSUNO ,  YASUHIRO OKAWA

IPC: B23K35/362 ,  B23K35/36 ,  B23K35/26

Abstract: A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.

公开(公告)号：US20230347454A1

公开(公告)日：2023-11-02

申请号：US18346297

申请日：2023-07-03

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NAOMICHI OHASHI ,  YASUHIRO OKAWA ,  KOSO MATSUNO

IPC: B23K35/362 ,  B23K35/36

CPC classification number: B23K35/362 ,  B23K35/3613 ,  B23K2101/36

Abstract: A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of −490 kJ/mol or more, the average free energy of oxide formation being a sum of products (Ai×Bi) of a molar ratio (Ai) of each of the at least two types of metal elements (i) based on all the at least two types of metal elements constituting the at least two types of solder powders included in the solder paste and a free energy (Bi kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121° C. or lower, the average melting point being a sum of products (Cj×Dj) of a mass ratio (Cj) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (Dj° C.) of the each of the at least two types of solder powders.

公开(公告)号：US20220030721A1

公开(公告)日：2022-01-27

申请号：US17367269

申请日：2021-07-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NAOMICHI OHASHI ,  YASUHIRO OKAWA ,  KOSO MATSUNO

IPC: H05K3/34 ,  H05K1/09 ,  H05K1/03 ,  B23K1/00

Abstract: A method for mounting an electronic component on a resin base material, the method including: (1) preparing the resin base material having a wiring pattern formed of a conductive paste; (2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material; (3) placing the electronic component on the solder paste; and (4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.