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公开(公告)号：US20210380747A1
公开(公告)日：2021-12-09
申请号：US17282695
申请日：2019-09-30
Inventor： KEISUKE KAWASHIMA , KOSO MATSUNO
IPC: C08G18/00
Abstract: There is provided a photocurable composition including Component (A): epoxy compound, Component (B): acrylic ester compound, Component (C): isocyanate compound, Component (D): photobase generator, and Component (E): compound having a thiol group, in which Component (A) has two or more epoxy groups in one molecule, Component (B) has two or more acryloyl groups in one molecule, Component (C) has two or more isocyanate groups in one molecule, and Component (E) has two or more thiol groups in one molecule, and a ratio of a total mass of Component (A), Component (B), Component (C), and Component (D) to a mass of Component (E) is (Component (A)+Component (B)+Component (C)+Component (D)):Component (E)=74:26 to 20:80.
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公开(公告)号：US20210129273A1
公开(公告)日：2021-05-06
申请号：US17073461
申请日：2020-10-19
Inventor： NAOMICHI OHASHI , KOSO MATSUNO , YASUHIRO OKAWA
IPC: B23K35/362 , B23K35/36 , B23K35/26
Abstract: A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.
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公开(公告)号：US20230347454A1
公开(公告)日：2023-11-02
申请号：US18346297
申请日：2023-07-03
Inventor： NAOMICHI OHASHI , YASUHIRO OKAWA , KOSO MATSUNO
IPC: B23K35/362 , B23K35/36
CPC classification number: B23K35/362 , B23K35/3613 , B23K2101/36
Abstract: A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of −490 kJ/mol or more, the average free energy of oxide formation being a sum of products (Ai×Bi) of a molar ratio (Ai) of each of the at least two types of metal elements (i) based on all the at least two types of metal elements constituting the at least two types of solder powders included in the solder paste and a free energy (Bi kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121° C. or lower, the average melting point being a sum of products (Cj×Dj) of a mass ratio (Cj) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (Dj° C.) of the each of the at least two types of solder powders.
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公开(公告)号：US20220030721A1
公开(公告)日：2022-01-27
申请号：US17367269
申请日：2021-07-02
Inventor： NAOMICHI OHASHI , YASUHIRO OKAWA , KOSO MATSUNO
Abstract: A method for mounting an electronic component on a resin base material, the method including: (1) preparing the resin base material having a wiring pattern formed of a conductive paste; (2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material; (3) placing the electronic component on the solder paste; and (4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.
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Patent Agency Ranking
公开(公告)号：US20190232438A1
公开(公告)日：2019-08-01
申请号：US16223952
申请日：2018-12-18
Inventor： HIROHISA HINO , NAOMICHI OHASHI , YASUHIRO SUZUKI , KOSO MATSUNO
CPC classification number: B23K35/362 , B23K35/025 , B23K35/262 , B23K2101/40 , B23K2101/42 , C22C13/02 , H01L24/16 , H01L24/81 , H01L2224/16227 , H01L2224/16501 , H01L2224/81815 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01083 , H01L2924/014 , H01L2924/0665 , H01L2924/069 , H05K1/181 , H05K3/3436 , H05K3/3457 , H05K3/3494 , H05K2201/10636 , H05K2201/10734
Abstract: Provided herein is a solder paste having low viscosity and easy coatability, and that provides high reinforcement for electronic components while satisfying both high room-temperature adhesion and high repairability, and forming a cured product of excellent properties, for example, high insulation against humidity. Amount structure including an electronic component mounted with the solder paste is also provided. The solder paste contains a solder powder and a flux. The flux contains an epoxy resin, a reactive diluent, a curing agent, an organic acid, and a rubber modified epoxy resin. The reactive diluent contains a compound having two or more epoxy groups, and has a viscosity of 150 mPa·s or more and 700 mPa·s or less. The reactive diluent has a total chlorine content of 0.5 weight % or less, and is contained in a proportion of 5 weight % or more and 45 weight % or less with respect to a total weight of the flux.
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公开(公告)号：US20220403183A1
公开(公告)日：2022-12-22
申请号：US17805328
申请日：2022-06-03
Inventor： NAOMICHI OHASHI , KOSO MATSUNO
Abstract: A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.
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公开(公告)号：US20210309829A1
公开(公告)日：2021-10-07
申请号：US17274225
申请日：2019-10-16
Inventor： NAOMICHI OHASHI , KOSO MATSUNO , YASUHIRO SUZUKI
Abstract: A curable resin composition contains a thermosetting resin, a curing agent, and one or more selected from the group consisting of organic acids, amines, and amine salts, and a percentage of a total amount of the one or more selected from the group with respect to a total mass of the curable resin composition is 0.3% by mass or more and 2.2% by mass or less.
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公开(公告)号：US20210121992A1
公开(公告)日：2021-04-29
申请号：US17073466
申请日：2020-10-19
Inventor： NAOMICHI OHASHI , YASUHIRO OKAWA , KOSO MATSUNO
IPC: B23K35/362 , B23K35/36
Abstract: A solder paste containing a solder powder and a flux, in which the flux contains a keto acid and a hydroxy group-containing compound different from the keto acid, and the keto acid has a melting point of 60° C. or lower, the hydroxy group-containing compound has a melting point of 60° C. or lower and has at least three hydroxy groups in the molecule, and a content of the keto acid, a content of the hydroxy group-containing compound and a content of the solder powder satisfy Expressions (1) and (2), W1×⅓≤W2≤W1×⅚ (1) (W1+W2)/W3×100≥2.0 (2) where W1 represents a weight (g) of the keto acid, W2 represents a weight (g) of the hydroxy group-containing compound, and W3 represents a weight (g) of the solder powder.
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公开(公告)号：US20200325252A1
公开(公告)日：2020-10-15
申请号：US16836946
申请日：2020-04-01
Inventor： KEISUKE KAWASHIMA , KOSO MATSUNO
Abstract: Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.
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