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公开(公告)号：US20210129273A1
公开(公告)日：2021-05-06
申请号：US17073461
申请日：2020-10-19
Inventor： NAOMICHI OHASHI , KOSO MATSUNO , YASUHIRO OKAWA
IPC: B23K35/362 , B23K35/36 , B23K35/26
Abstract: A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.
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公开(公告)号：US20170345960A1
公开(公告)日：2017-11-30
申请号：US15485831
申请日：2017-04-12
Inventor： KEI TOYOTA , NAOMICHI OHASHI
IPC: H01L31/055 , C09K11/02 , C09K11/59 , H01L31/048
CPC classification number: H01L31/055 , C09K11/025 , C09K11/595 , H01L31/048 , H01L31/0481 , Y02E10/52
Abstract: Provided herein is a solar cell module with which high output can be achieved through wavelength conversion of shorter wavelength light to longer wavelength light while extending life by removing ultraviolet light. A method of manufacture of the solar cell module is also provided. The solar cell module includes a back sheet, a first sealing material layer, a plurality of photoelectric conversion devices that are electrically connected to one another by an electrode material, a second sealing material layer, and a protective glass that are laminated in this order. The second sealing material layer is configured from a first layer, a second layer, and a third layer. The first layer is disposed in contact with the protective glass, and formed of a transparent material containing a phosphor. The third layer is disposed in contact with the photoelectric conversion, devices, and formed of a transparent material containing an ultraviolet absorber. The second layer is a transparent material disposed between the first layer and the third layer.
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公开(公告)号：US20170040184A1
公开(公告)日：2017-02-09
申请号：US15212158
申请日：2016-07-15
Inventor： HIROHISA HINO , YASUHIRO SUZUKI , MASATO MORI , NAOMICHI OHASHI
IPC: H01L21/48 , H01L25/065 , H01L23/498
CPC classification number: H01L21/4853 , H01L23/49816 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2021/60007 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/15311
Abstract: A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.
Abstract translation: 一种安装结构，包括：具有第一凸起的第一部件; 具有第二凸起的第二部件; 具有主安装面和副安装面的安装部件; 连接主安装表面上的电极和第一凸起的第一焊料; 连接所述辅助安装表面上的电极和所述第二凸起的第二焊料; 以及覆盖所述第一焊料的一部分且不与所述主安装面接触的增强树脂。
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公开(公告)号：US20220403183A1
公开(公告)日：2022-12-22
申请号：US17805328
申请日：2022-06-03
Inventor： NAOMICHI OHASHI , KOSO MATSUNO
Abstract: A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.
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公开(公告)号：US20210309829A1
公开(公告)日：2021-10-07
申请号：US17274225
申请日：2019-10-16
Inventor： NAOMICHI OHASHI , KOSO MATSUNO , YASUHIRO SUZUKI
Abstract: A curable resin composition contains a thermosetting resin, a curing agent, and one or more selected from the group consisting of organic acids, amines, and amine salts, and a percentage of a total amount of the one or more selected from the group with respect to a total mass of the curable resin composition is 0.3% by mass or more and 2.2% by mass or less.
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Patent Agency Ranking
公开(公告)号：US20210121992A1
公开(公告)日：2021-04-29
申请号：US17073466
申请日：2020-10-19
Inventor： NAOMICHI OHASHI , YASUHIRO OKAWA , KOSO MATSUNO
IPC: B23K35/362 , B23K35/36
Abstract: A solder paste containing a solder powder and a flux, in which the flux contains a keto acid and a hydroxy group-containing compound different from the keto acid, and the keto acid has a melting point of 60° C. or lower, the hydroxy group-containing compound has a melting point of 60° C. or lower and has at least three hydroxy groups in the molecule, and a content of the keto acid, a content of the hydroxy group-containing compound and a content of the solder powder satisfy Expressions (1) and (2), W1×⅓≤W2≤W1×⅚ (1) (W1+W2)/W3×100≥2.0 (2) where W1 represents a weight (g) of the keto acid, W2 represents a weight (g) of the hydroxy group-containing compound, and W3 represents a weight (g) of the solder powder.
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公开(公告)号：US20180229333A1
公开(公告)日：2018-08-16
申请号：US15872954
申请日：2018-01-16
Inventor： HIROHISA HINO , NAOMICHI OHASHI , YASUHIRO SUZUKI
IPC: B23K35/02 , H05K3/34 , B23K35/26 , C08L63/10 , B23K35/362 , B23K101/42
CPC classification number: B23K35/025 , B23K35/264 , B23K35/362 , B23K2101/42 , C08G59/4207 , C08L63/00 , C08L63/10 , H05K3/225 , H05K3/3442 , H05K3/3463 , H05K3/3484 , H05K3/3489 , H05K2201/0133 , H05K2201/10977 , C08K5/08
Abstract: Provided herein are a solder paste and a mount structure having excellent repairability while maintaining high adhesion at the operating temperature of a semiconductor component. The solder paste is configured from a solder powder and a flux. The flux contains an epoxy resin, a curing agent, a rubber modified epoxy resin, and an organic acid. The rubber modified epoxy resin is contained in a proportion of 3 weight % to 35 weight % with respect to the total weight of the flux.
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公开(公告)号：US20230347454A1
公开(公告)日：2023-11-02
申请号：US18346297
申请日：2023-07-03
Inventor： NAOMICHI OHASHI , YASUHIRO OKAWA , KOSO MATSUNO
IPC: B23K35/362 , B23K35/36
CPC classification number: B23K35/362 , B23K35/3613 , B23K2101/36
Abstract: A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of −490 kJ/mol or more, the average free energy of oxide formation being a sum of products (Ai×Bi) of a molar ratio (Ai) of each of the at least two types of metal elements (i) based on all the at least two types of metal elements constituting the at least two types of solder powders included in the solder paste and a free energy (Bi kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121° C. or lower, the average melting point being a sum of products (Cj×Dj) of a mass ratio (Cj) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (Dj° C.) of the each of the at least two types of solder powders.
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公开(公告)号：US20220030721A1
公开(公告)日：2022-01-27
申请号：US17367269
申请日：2021-07-02
Inventor： NAOMICHI OHASHI , YASUHIRO OKAWA , KOSO MATSUNO
Abstract: A method for mounting an electronic component on a resin base material, the method including: (1) preparing the resin base material having a wiring pattern formed of a conductive paste; (2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material; (3) placing the electronic component on the solder paste; and (4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.
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公开(公告)号：US20190232438A1
公开(公告)日：2019-08-01
申请号：US16223952
申请日：2018-12-18
Inventor： HIROHISA HINO , NAOMICHI OHASHI , YASUHIRO SUZUKI , KOSO MATSUNO
CPC classification number: B23K35/362 , B23K35/025 , B23K35/262 , B23K2101/40 , B23K2101/42 , C22C13/02 , H01L24/16 , H01L24/81 , H01L2224/16227 , H01L2224/16501 , H01L2224/81815 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01083 , H01L2924/014 , H01L2924/0665 , H01L2924/069 , H05K1/181 , H05K3/3436 , H05K3/3457 , H05K3/3494 , H05K2201/10636 , H05K2201/10734
Abstract: Provided herein is a solder paste having low viscosity and easy coatability, and that provides high reinforcement for electronic components while satisfying both high room-temperature adhesion and high repairability, and forming a cured product of excellent properties, for example, high insulation against humidity. Amount structure including an electronic component mounted with the solder paste is also provided. The solder paste contains a solder powder and a flux. The flux contains an epoxy resin, a reactive diluent, a curing agent, an organic acid, and a rubber modified epoxy resin. The reactive diluent contains a compound having two or more epoxy groups, and has a viscosity of 150 mPa·s or more and 700 mPa·s or less. The reactive diluent has a total chlorine content of 0.5 weight % or less, and is contained in a proportion of 5 weight % or more and 45 weight % or less with respect to a total weight of the flux.
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