公开(公告)号：US20180098461A1

公开(公告)日：2018-04-05

申请号：US15563649

申请日：2016-06-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOJI MATSUNO ,  KAZUHIKO KUBO

IPC: H05K7/20 ,  G02F1/1333

CPC classification number: H05K7/20472 ,  G02F1/133382 ,  G02F1/133385 ,  H01L23/367 ,  H01L23/3735 ,  H05K7/20954

Abstract: A heat conductive sheet includes a heat dissipating sheet, a first heat insulating layer provided above the heat dissipating sheet, a first sheet provided above the first heat insulating layer, and a second sheet provided below the heat dissipating sheet. The first sheet includes a first protruding portion protruding from the heat dissipating sheet viewing from above. The second sheet includes a second protruding portion protruding from the heat dissipating sheet viewing from above. A thermal conductivity of the first heat insulating layer is lower than any of a thermal conductivity of the first sheet, a thermal conductivity of the second sheet, and a thermal conductivity of the heat dissipating sheet. The first protruding portion overlaps and the second protruding portion viewing from above.

公开(公告)号：US20170156201A1

公开(公告)日：2017-06-01

申请号：US15325526

申请日：2015-09-09

Applicant: Panasonic Intellectual Property Management Co. Ltd.

Inventor： MASAFUMI NAKAYAMA ,  KOJI MATSUNO

IPC: H05K1/02 ,  F28F13/18 ,  F28F3/12 ,  H05K1/18 ,  F28F21/06

CPC classification number: H05K1/0204 ,  B32B7/02 ,  F28F3/12 ,  F28F13/18 ,  F28F21/067 ,  F28F2275/025 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/284 ,  H05K7/20509 ,  H01L2924/00

Abstract: A heat-dissipating sheet includes a thermally-conductive resin sheet, an adhesive layer on an upper surface of the thermally-conductive resin sheet, and a thermally-conductive film on an upper surface of the adhesive layer. The thermally-conductive film has a higher thermal conductivity than the thermally-conductive resin sheet. The thermally-conductive resin sheet has a thin portion that is locally thin to form a recess in a lower surface of the thermally-conductive resin sheet. The recess may be an aperture passing through the thermally-conductive resin sheet. The adhesive layer is exposed from the aperture.