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16 条记录 (耗时 0.028 秒)

    Dual Impeller Push-Pull Axial Fan Heat Sink
    3.
    发明申请
    Dual Impeller Push-Pull Axial Fan Heat Sink 有权
    双叶轮推拉轴流风扇散热器

    公开(公告)号：US20070247810A1

    公开(公告)日：2007-10-25

    申请号：US11770991

    申请日：2007-06-29

    申请人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    发明人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    IPC分类号： H05K7/20 ,  B23P11/00

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

    摘要： A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

    摘要翻译： 提出了一种风扇水槽，其包括双叶轮推拉式轴流风扇和散热器来冷却热电子设备。 轴流式风扇具有轮毂马达，径向靠近轮毂马达的第一叶轮和径向远离轮毂马达的第二叶轮，其中第一叶轮沿第一方向推动空气，而第二叶轮将空气推入 第二个方向。 散热器在轴流风扇和热电子设备之间定向，使得热电子设备，散热器和轴流风扇轴向定向，其中冷空气通过轴流风扇中的一个叶轮被推到散热器上， 并且其中来自所述散热器的加热空气被所述轴流风扇中的另一个叶轮除去。

    Dual fan heat sink with flow directors
    4.
    发明申请
    Dual fan heat sink with flow directors 有权

    公开(公告)号：US20060002083A1

    公开(公告)日：2006-01-05

    申请号：US10881357

    申请日：2004-06-30

    申请人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    发明人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    IPC分类号： H05K7/20

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink having air flow directors on each of multiple fins attached to a heat sink base. The air flow directors direct air flow from dual fans towards a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. In one embodiment, a protrusion in the geometric center of the heat sink base provides additional cooling from air impingement, and also directs air towards the upper portions of the fins. The use of dual fans allows the fans to run at a lower speed than a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan if one of the fans should fail.

    Coaxial air ducts and fans for cooling an electronic component
    5.
    发明申请
    Coaxial air ducts and fans for cooling an electronic component 失效
    用于冷却电子元件的同轴风道和风扇

    公开(公告)号：US20060039110A1

    公开(公告)日：2006-02-23

    申请号：US10920575

    申请日：2004-08-18

    申请人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    发明人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    IPC分类号： H05K7/20

    CPC分类号： H01L23/467 ,  F04D19/007 ,  F04D25/0613 ,  F04D25/082 ,  F04D25/166 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A structure for cooling an electronic component includes a heat sink attached to the component, an inner air duct extending into a central portion of the heat sink, and an outer air duct extending into an outer portion of the heat sink. In inner fan, within the inner air duct, moves air in one direction, while an outer fan, in the outer air duct, moves air in the other direction. The fans may be built as separate rotors, or as separate portions of a single rotor.

    摘要翻译： 用于冷却电子部件的结构包括附接到部件的散热器，延伸到散热器的中心部分的内部空气管道和延伸到散热器的外部部分的外部空气管道。 在内部风扇内部，在内部空气管道内沿一个方向移动空气，而外部空气管道中的外部风扇沿另一个方向移动空气。 风扇可以构建为单独的转子，或者作为单个转子的分离部分。

    Dual fan heat sink
    7.
    发明申请
    Dual fan heat sink 有权

    公开(公告)号：US20060002082A1

    公开(公告)日：2006-01-05

    申请号：US10881339

    申请日：2004-06-30

    申请人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    发明人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    IPC分类号： H05K7/20

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink having graduated lengths of fins, with the tallest fins being in the center of the heat sink to provide maximum heat removal from a mated integrated circuit (IC) chip. Dual fans impinge air against the fins, and particularly the tallest fins, to provide a highly efficient system for heat removal from the IC chip. By reducing the size of the lateral fins, additional space is made available for the dual fans. The use of the dual fans allows the fans to run at a lower speed that a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan system if one of the fans should fail.

    Interposable Heat Sink for Adjacent Memory Modules
    9.
    发明申请
    Interposable Heat Sink for Adjacent Memory Modules 有权
    相邻内存模块的可插拔散热器

    公开(公告)号：US20070201212A1

    公开(公告)日：2007-08-30

    申请号：US11746322

    申请日：2007-05-09

    申请人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

    发明人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

    IPC分类号： H05K7/20

    CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

    摘要翻译： 用于常规存储器模块（例如DIMM）的散热装置，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。

    MEMORY MODULE AIRFLOW REDIRECTOR
    10.
    发明申请
    MEMORY MODULE AIRFLOW REDIRECTOR 审中-公开
    记忆模块气流重排器

    公开(公告)号：US20070121286A1

    公开(公告)日：2007-05-31

    申请号：US11164576

    申请日：2005-11-29

    申请人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    发明人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

    IPC分类号： G06F1/20

    CPC分类号： G06F1/20

    摘要： A method, apparatus and system are disclosed for utilizing a mechanical air redirection device with air cooled computer assemblies in order to evenly distribute airflow to provide balanced cooling of heat producing components, such as memory chips and boards. The present invention improves the thermal distribution and dissipation of heat for computer and memory systems when some memory devices are removed or left uninstalled.

    摘要翻译： 公开了一种用于利用具有空气冷却的计算机组件的机械空气重定向装置的方法，装置和系统，以便均匀地分配气流以提供诸如存储器芯片和板的发热部件的平衡冷却。 本发明改进了当一些存储器件被移除或者被卸下时计算机和存储器系统的热分布和散热。