摘要:
A NFC enabled device to couple inductively to the H field of an RF signal and a regulator to regulate a voltage derived from an RF signal inductively coupled to the inductive coupler. The regulator has at least one voltage controlled impedance having a switch on voltage. A regulator controller provides a control voltage to each voltage controlled impedance such as that the control voltage is not less than the switch on voltage of the voltage controlled impedance.
摘要:
A NFC enabled device to couple inductively to the H field of an RF signal and a regulator to regulate a voltage derived from an RF signal inductively coupled to the inductive coupler. The regulator has at least one voltage controlled impedance having a switch on voltage. A regulator controller provides a control voltage to each voltage controlled impedance such as that the control voltage is not less than the switch on voltage of the voltage controlled impedance.
摘要:
A demodulator for demodulating a modulated signal has a peak detector (206) with an input (100) coupled to receive the modulated signal and an output (207) to supply a peak detector output signal. The peak detector has a charge storer (314) coupled to the peak detector output so that the peak detector output signal is provided by a voltage across the charge storer (314) and a comparator (313) having a first comparator input coupled to the peak detector input to receive the modulated signal and a second comparator input coupled to the peak detector output to receive the peak detector output signal. The comparator (313) provides a comparison signal representing a comparison between the voltage of the modulated signal and the peak detector output signal. A charging controller (315, 316 and 318) charges the charge storer (314) so as to increase the output voltage when the comparator (313) provides a first signal indicating that the voltage of the modulated signal is higher than the voltage of the peak detector output signal and discharges the charge storer (314) so as to decrease the output voltage when the comparator (313) provides a second signal indicating that the voltage of the modulated signal is lower than the voltage of the peak detector output signal.
摘要:
A demodulator for demodulating a modulated signal has a peak detector (206) with an input (100) coupled to receive the modulated signal and an output (207) to supply a peak detector output signal. The peak detector has a charge storer (314) coupled to the peak detector output so that the peak detector output signal is provided by a voltage across the charge storer (314) and a comparator (313) having a first comparator input coupled to the peak detector input to receive the modulated signal and a second comparator input coupled to the peak detector output to receive the peak detector output signal. The comparator (313) provides a comparison signal representing a comparison between the voltage of the modulated signal and the peak detector output signal. A charging controller (315, 316 and 318) charges the charge storer (314) so as to increase the output voltage when the comparator (313) provides a first signal indicating that the voltage of the modulated signal is higher than the voltage of the peak detector output signal and discharges the charge storer (314) so as to decrease the output voltage when the comparator (313) provides a second signal indicating that the voltage of the modulated signal is lower than the voltage of the peak detector output signal.
摘要:
A near field RF communicator has an inductive coupler (10) to enable inductive coupling with a magnetic field of an RF signal. A demodulator (102) extracts modulation from an inductively coupled magnetic field. A power provider (109) provides a first power supply for the communicator independent of any inductively coupled signal while a power deriver derives a second power supply from an RF signal inductively coupled to the antenna. A regulator (206; 1302) regulates a voltage supplied by at least one of the first and second power supplies on the basis of a comparison with a reference voltage. A modulator (M) is provided to modulate an inductively coupled magnetic field with data to be communicated via the inductive coupling. In an example, a regulator controller is provided to prevent operation of the regulator in the event of a magnetic field amplitude below a predetermined level or the presence of modulation.
摘要:
A method for manufacturing a photodiode array includes providing a semiconductor substrate having first and second main surfaces opposite to each other. The semiconductor substrate has a first layer of a first conductivity proximate the first main surface and a second layer of a second conductivity proximate the second main surface. A via is formed in the substrate which extends to a first depth position relative to the first main surface. The via has a first aspect ratio. Generally simultaneously with forming the via, an isolation trench is formed in the substrate spaced apart from the via which extends to a second depth position relative to the first main surface. The isolation trench has a second aspect ratio different from the first aspect ratio.
摘要:
A near field RF communicator has an inductive coupler (223) to enable inductive coupling with a magnetic field of an RF signal; a rectifier (213,214,215,216) to rectify an AC voltage derived from an RF signal inductively coupled to the inductive coupler (223); and a regulator (209,210,211,220,221,900) to regulate a voltage derived from an RF signal inductively coupled to the inductive coupler, the regulator having a voltage-controlled impedance (210, 211) and a regulator controller (209) to provide a control voltage for the voltage controlled impedance and to vary the control voltage in dependence upon a current flowing through the voltage controlled impedance (210, 211). To prevent the voltage regulator from drawing excess current and energy from an RF field in which the communicator is present the voltage regulator is controlled to provide a chosen impedance characteristic.
摘要:
A photodiode having an increased proportion of light-sensitive area to light-insensitive area includes a semiconductor having a backside surface and a light-sensitive frontside surface. The semiconductor includes a first active layer having a first conductivity, a second active layer having a second conductivity opposite the first conductivity, and an intrinsic layer separating the first and second active layers. A plurality of isolation trenches are arranged to divide the photodiode into a plurality of cells. Each cell has a total frontside area including a cell active frontside area sensitive to light and a cell inactive frontside area not sensitive to light. The cell active frontside area forms at least 95 percent of the cell total frontside area. A method of forming the photodiode is also disclosed.
摘要:
A semiconductor on insulator (SOI) wafer includes a semiconductor substrate having first and second main surfaces opposite to each other. A dielectric layer is disposed on at least a portion of the first main surface of the semiconductor substrate. A device layer has a first main surface and a second main surface. The second main surface of the device layer is disposed on a surface of the dielectric layer opposite to the semiconductor substrate. A plurality of intended die areas are defined on the first main surface of the device layer. The plurality of intended die areas are separated from one another. A plurality of die access trenches are formed in the semiconductor substrate from the second main surface. Each of the plurality of die access trenches are disposed generally beneath at least a respective one of the plurality of intended die areas.
摘要:
A bonded-wafer semiconductor device includes a semiconductor substrate, a buried oxide layer disposed on a first main surface of the semiconductor substrate and a multi-layer device stack. The multi-layer device stack includes a first device layer of a first conductivity disposed on the buried oxide layer, a second device layer of a second conductivity disposed on the first device layer, a third device layer of the first conductivity disposed on the second device layer and a fourth device layer of the second conductivity disposed on the third device layer. A trench is formed in the multi-layer device stack. A mesa is defined by the trench. The mesa has first and second sidewalls. A first anode/cathode layer is disposed on a first sidewall of the multi-layer device stack, and a second anode/cathode layer is disposed on the second sidewall of the multi-layer device stack.