摘要:
An assembly for use in a solid state directional lamp is disclosed. The assembly includes a multilayer FR4 printed circuit board and a metal heat spreader assembled with the multilayer FR4 printed circuit board. The assembly is configured to mount a plurality of solid state light emitters. The multilayer FR4 printed circuit board defines an aperture and a least a portion of the metal heat spreader is positioned in the aperture of the multilayer FR4 printed circuit board. The portion of the heat spreader positioned in the aperture of the multilayer FR4 printed circuit board is in communication with heat dissipation means.
摘要:
An assembly for use in a solid state directional lamp is disclosed. The assembly includes a multilayer FR4 printed circuit board and a metal heat spreader assembled with the multilayer FR4 printed circuit board. The assembly is configured to mount a plurality of solid state light emitters. The multilayer FR4 printed circuit board defines an aperture and a least a portion of the metal heat spreader is positioned in the aperture of the multilayer FR4 printed circuit board. The portion of the heat spreader positioned in the aperture of the multilayer FR4 printed circuit board is in communication with heat dissipation means.
摘要:
A lighting device comprising a junction box, a trim element and a solid state light emitter, at least a portion of a space defined by regions of the trim element within a space defined by regions of the junction box, the light emitter within the trim element space. A lighting device comprising a trim element (with at least two regions) and a solid state light emitter, in which at least a first part of the first region can be positioned in a first space with the second region outside the first space, the light emitter within the first part. A lighting device, comprising a trim element (which comprises at least two regions), part of an exterior of which defines a first space, at least a first part of the first region within the first space, a solid state light emitter within the first part. Methods of installing a light emitter.
摘要:
A lighting device comprising a junction box, a trim element and a solid state light emitter, at least a portion of a space defined by regions of the trim element within a space defined by regions of the junction box, the light emitter within the trim element space. A lighting device comprising a trim element (with at least two regions) and a solid state light emitter, in which at least a first part of the first region can be positioned in a first space with the second region outside the first space, the light emitter within the first part. A lighting device, comprising a trim element (which comprises at least two regions), part of an exterior of which defines a first space, at least a first part of the first region within the first space, a solid state light emitter within the first part. Methods of installing a light emitter.
摘要:
In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.
摘要:
A thermal isolation arrangement for an LED lamp is disclosed. Embodiments of the invention provide thermal isolation between the power supply and the LED assembly of an LED lamp, in most cases allowing the power supply to operate in a lower temperature range than would otherwise be possible. At least one contact feature is provided between the power supply and the LED assembly to maintain a thermal transfer gap between the power supply and the LED assembly. A contact feature can be, for example, a triangular ridge or a conical protrusion. In some embodiments, a thermal isolation device provides the contact feature or contact features. An LED lamp according to example embodiments of the invention can have a modular design and/or can include an Edison base and/or an optical element or optical elements disposed to emit light from the LED lamp.
摘要:
In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.
摘要:
A thermal isolation arrangement for an LED lamp is disclosed. Embodiments of the invention provide thermal isolation between the power supply and the LED assembly of an LED lamp, in most cases allowing the power supply to operate in a lower temperature range than would otherwise be possible. At least one contact feature is provided between the power supply and the LED assembly to maintain a thermal transfer gap between the power supply and the LED assembly. A contact feature can be, for example, a triangular ridge or a conical protrusion. In some embodiments, a thermal isolation device provides the contact feature or contact features. An LED lamp according to example embodiments of the invention can have a modular design and/or can include an Edison base and/or an optical element or optical elements disposed to emit light from the LED lamp.