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1.发明授权Visual patterning for a cover system using modular units on a patterned backing 有权用于在图案化背衬上使用模块化单元的覆盖系统的可视图案化公开(公告)号：US08898979B2
公开(公告)日：2014-12-02
申请号：US13601867
申请日：2012-08-31
IPC分类号： E04F13/00
CPC分类号： H05K7/1455
摘要： A modular panel unit according to one embodiment includes a major subunit adapted for being secured to a keyed backing panel, and at least one minor subunit. The major subunit includes at least one connector adapted for coupling to a corresponding connection feature of the keyed backing panel in order to secure the major subunit to the keyed backing panel; and one or more coupling features. Each minor subunit includes: one or more couplers adapted for coupling to the one or more coupling features of the major subunit in order to secure the minor subunit to the major subunit. Additional systems and methods are also disclosed.
摘要翻译： 根据一个实施例的模块化面板单元包括适于固定到键盘背板和主要子单元的主要子单元。 主亚基包括至少一个连接器，其适于联接到键控背衬面板的对应连接特征，以便将主要亚单元固定到键控背衬面板; 和一个或多个耦合特征。 每个次要亚基包括：一个或多个耦合器，其适于耦合到主要亚单元的一个或多个耦合特征，以便将次要亚基固定到主要亚单位。 还公开了附加的系统和方法。
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2.发明申请VISUAL PATTERNING FOR A COVER SYSTEM USING MODULAR UNITS ON A PATTERNED BACKING 有权在模式化背景下使用模块化单元的封面系统的视觉图案公开(公告)号：US20140062275A1
公开(公告)日：2014-03-06
申请号：US13601867
申请日：2012-08-31
CPC分类号： H05K7/1455
摘要： A modular panel unit according to one embodiment includes a major subunit adapted for being secured to a keyed backing panel, and at least one minor subunit. The major subunit includes at least one connector adapted for coupling to a corresponding connection feature of the keyed backing panel in order to secure the major subunit to the keyed backing panel; and one or more coupling features. Each minor subunit includes: one or more couplers adapted for coupling to the one or more coupling features of the major subunit in order to secure the minor subunit to the major subunit. Additional systems and methods are also disclosed.
摘要翻译： 根据一个实施例的模块化面板单元包括适于固定到键盘背板和主要子单元的主要子单元。 主亚基包括至少一个连接器，其适于联接到键控背衬面板的对应连接特征，以便将主要亚单元固定到键控背衬面板; 和一个或多个耦合特征。 每个次要亚基包括：一个或多个耦合器，其适于耦合到主要亚单元的一个或多个耦合特征，以便将次要亚基固定到主要亚单位。 还公开了附加的系统和方法。
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公开(公告)号：US07558066B2
公开(公告)日：2009-07-07
申请号：US12044015
申请日：2008-03-07
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.
摘要翻译： 本文公开了一种模块冷却系统，包括：与电路板可操作地连通的模块，邻接电路板的加强件，邻近模块的散热器，朝向模块偏置散热器的第一偏置构件，多个不影响 紧固件位置地固定散热器;以及第二偏置构件，将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法，包括：将模块电连接到电路板，将加强件邻接到电路板，将散热器邻接到模块，用偏置构件偏置散热器朝向 模块，用不影响紧固件固定散热器，并且用电路板和模块朝向散热器的第二偏置构件偏置。
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4.发明授权Printed circuit board capable of receiving an on-board battery from multiple orientations 有权能够从多个方向接收车载电池的印刷电路板公开(公告)号：US07267550B1
公开(公告)日：2007-09-11
申请号：US11605883
申请日：2006-11-29
申请人： Eric A. Eckberg , Michael S. Good , Ray C. Laning , Mark D. Pfeifer , Scott A. Shurson , Matthew C. Zehrer
发明人： Eric A. Eckberg , Michael S. Good , Ray C. Laning , Mark D. Pfeifer , Scott A. Shurson , Matthew C. Zehrer
IPC分类号： H01R12/00
CPC分类号： G06F1/185 , H01M2/1066 , H01M10/425 , H01R12/7076 , H01R12/721 , H05K1/141 , H05K3/301 , H05K3/366 , H05K3/368 , H05K2201/09954 , H05K2201/10037
摘要： A printed circuit board capable of receiving an on-board battery from multiple orientations is disclosed. The movement of the on-board battery on the printed circuit board is directed via one or more guide tabs on the on-board battery that fit within one or more guide rails attached to the printed circuit board. A cam lever is attached to the on-board battery and enables a user to utilize mechanical advantage to install and/or remove the on-board battery on the printed circuit board. A pull tab attached to the on-board battery provides additional surface area to distribute the force when a user removes the on-board battery. The on-board battery can be installed and/or removed orthogonally and/or horizontally to the printed circuit board during the operation of the printed circuit board.
摘要翻译： 公开了一种能够从多个方向接收车载电池的印刷电路板。 板载电池在印刷电路板上的移动通过安装在连接到印刷电路板的一个或多个导轨内的车载电池上的一个或多个引导片引导。 凸轮杆连接到车载电池，并且使用户能够利用机械优点来安装和/或移除印刷电路板上的车载电池。 连接到板载电池的拉片提供额外的表面积，以在用户移除车载电池时分配力。 在印刷电路板的操作期间，板上电池可以与印刷电路板正交和/或水平地安装和/或去除。
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公开(公告)号：US20080151504A1
公开(公告)日：2008-06-26
申请号：US12044015
申请日：2008-03-07
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.
摘要翻译： 本文公开了一种模块冷却系统，包括：与电路板可操作地连通的模块，邻接电路板的加强件，邻近模块的散热器，朝向模块偏置散热器的第一偏置构件，多个不影响 紧固件位置地固定散热器;以及第二偏置构件，将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法，包括：将模块电连接到电路板，将加强件邻接到电路板，将散热器邻接到模块，用偏置构件偏置散热器朝向 模块，用不影响紧固件固定散热器，并且用电路板和模块朝向散热器的第二偏置构件偏置。
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公开(公告)号：US07375963B2
公开(公告)日：2008-05-20
申请号：US11279266
申请日：2006-04-11
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.
摘要翻译： 本文公开了一种模块冷却系统，包括：与电路板可操作地连通的模块，邻接电路板的加强件，邻近模块的散热器，朝向模块偏置散热器的第一偏置构件，多个不影响 紧固件位置地固定散热器;以及第二偏置构件，将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法，包括：将模块电连接到电路板，将加强件邻接到电路板，将散热器邻接到模块，用偏置构件偏置散热器朝向 模块，用不影响紧固件固定散热器，并且用电路板和模块朝向散热器的第二偏置构件偏置。
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