摘要:
An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要:
A modular panel unit according to one embodiment includes a major subunit adapted for being secured to a keyed backing panel, and at least one minor subunit. The major subunit includes at least one connector adapted for coupling to a corresponding connection feature of the keyed backing panel in order to secure the major subunit to the keyed backing panel; and one or more coupling features. Each minor subunit includes: one or more couplers adapted for coupling to the one or more coupling features of the major subunit in order to secure the minor subunit to the major subunit. Additional systems and methods are also disclosed.
摘要:
An information technology system includes a micro projector display for displaying status, operating, troubleshooting, and location information. An image output from the micro projector display is viewable from outside the enclosure, for example on a cabinet door, an optional retractable projection screen included with the enclosure, or a floor, wall, or ceiling of a room, or other external surface. In some embodiments of the invention, a micro display projector is adapted for removable electrical and mechanical connection to one or more docking ports on the information technology system. In some embodiments of the invention, a projection direction for the micro projector display is selectable.
摘要:
Components in a data storage subsystem are tracked, and their status monitored, with the use of memory devices such as RFID tags. In the practice of the invention, a component of a data storage subsystem, such as a data recording device, is associated with a memory device, such as but not limited to a Radio Frequency Identification (RFID) tag, that is capable of storing information regarding the data storage component and configured to transmit such information upon interrogation by a reader device. The memory device is coupled to an indicator device that is configured to selectively indicate information about the data storage component.
摘要:
An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要:
Provided are a computer program product, system, and method promoting products in a virtual world. An association of product information for a product with a texture of an object assigned to the advertising user is provided for an advertising user. The product information with the texture of the object is rendered to be observable by interacting users in the virtual world when the texture of the object presenting the product information is within an observable range of avatars of the interacting users. Tracking information is updated for the advertising user in response to the texture of the object presenting the product information being within the observable range of the avatars of the interacting users. The tracking information generated for the advertising user is provided for use in determining rewards to assign to the advertising user for promoting the product.
摘要:
Transportation packaging may be used to ship or transport a product, such as an electronic device. The transportation packaging may be reused subsequent to the transport of the product by removing a shape defined by a pattern included on the transportation packaging, assembling or altering a portion of the removed pattern, and engaging the assembled pattern with the product. In a particular embodiment, the assembled pattern may provide a usability surface for at least one peripheral device to be used with the electronic device.