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公开(公告)号：US08970324B2
公开(公告)日：2015-03-03
申请号：US13201173
申请日：2010-02-08
申请人： Pavol Dudesek , Guenter Pudmich , Hannes Schiechl , Edmund Payr , Thomas Feichtinger , Werner Salz , Christian Hoffmann
发明人： Pavol Dudesek , Guenter Pudmich , Hannes Schiechl , Edmund Payr , Thomas Feichtinger , Werner Salz , Christian Hoffmann
IPC分类号： H01G4/12 , H01C7/18 , B32B18/00 , C04B35/453 , C04B35/495 , H03H1/00
CPC分类号： H01G4/1209 , B32B18/00 , C04B35/453 , C04B35/495 , C04B2235/3241 , C04B2235/3251 , C04B2235/3275 , C04B2235/3279 , C04B2235/3284 , C04B2235/3294 , C04B2235/3298 , C04B2237/34 , C04B2237/345 , H01C7/18 , H03H2001/0085
摘要： A multilayer component includes a dielectric ceramic material that can be co-sintered with a varistor ceramic to form a monolithic multilayer component according to the invention. The multilayer component therefore includes a layer of a varistor ceramic and another layer of a dielectric. Both layers can be arranged directly adjacent to one another in the multilayer component. In the multilayer component, metallizations are arranged on or between the ceramic layers. The metallizations are structured to form conductor sections and metallized areas. The metallizations form together with the ceramic layers alongside a varistor at least one further component selected from at least one of the component functions.
摘要翻译： 多层组件包括可与变阻器陶瓷共烧结以形成根据本发明的整体式多层组件的电介质陶瓷材料。 因此，多层组件包括一个变阻器陶瓷层和另一层电介质层。 两层可以在多层组件中彼此直接相邻布置。 在多层组件中，金属化被布置在陶瓷层上或陶瓷层之间。 金属化被构造成形成导体部分和金属化区域。 金属化与陶瓷层一起与变阻器一起形成至少一个选自至少一个部件功能的其它部件。
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公开(公告)号：US20120032757A1
公开(公告)日：2012-02-09
申请号：US13201173
申请日：2010-02-08
申请人： Pavol Dudesek , Guenter Pudmich , Hannes Schiechl , Edmund Payr , Thomas Feichtinger , Werner Salz , Christian Hoffmann
发明人： Pavol Dudesek , Guenter Pudmich , Hannes Schiechl , Edmund Payr , Thomas Feichtinger , Werner Salz , Christian Hoffmann
CPC分类号： H01G4/1209 , B32B18/00 , C04B35/453 , C04B35/495 , C04B2235/3241 , C04B2235/3251 , C04B2235/3275 , C04B2235/3279 , C04B2235/3284 , C04B2235/3294 , C04B2235/3298 , C04B2237/34 , C04B2237/345 , H01C7/18 , H03H2001/0085
摘要： A multilayer component includes a dielectric ceramic material that can be co-sintered with a varistor ceramic to form a monolithic multilayer component according to the invention. The multilayer component therefore includes a layer of a varistor ceramic and another layer of a dielectric. Both layers can be arranged directly adjacent to one another in the multilayer component. In the multilayer component, metallizations are arranged on or between the ceramic layers. The metallizations are structured to form conductor sections and metallized areas. The metallizations form together with the ceramic layers alongside a varistor at least one further component selected from at least one of the component functions.
摘要翻译： 多层组件包括可与变阻器陶瓷共烧结以形成根据本发明的整体式多层组件的电介质陶瓷材料。 因此，多层组件包括一个变阻器陶瓷层和另一层电介质层。 两层可以在多层组件中彼此直接相邻布置。 在多层组件中，金属化被布置在陶瓷层上或陶瓷层之间。 金属化被构造成形成导体部分和金属化区域。 金属化与陶瓷层一起与变阻器一起形成至少一个选自至少一个部件功能的其它部件。
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