利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

743 条记录 (耗时 0.032 秒)

    Vacuum packaging system
    1.
    发明授权
    Vacuum packaging system 有权
    真空包装系统

    公开(公告)号：US08042319B2

    公开(公告)日：2011-10-25

    申请号：US12469833

    申请日：2009-05-21

    申请人： Peng Liu ,  Pi-Jin Chen ,  Bing-Chu Du ,  Cai-Lin Guo ,  Liang Liu ,  Shou-Shan Fan

    发明人： Peng Liu ,  Pi-Jin Chen ,  Bing-Chu Du ,  Cai-Lin Guo ,  Liang Liu ,  Shou-Shan Fan

    IPC分类号： B65B55/00

    CPC分类号： H01J9/46 ,  H01J9/385 ,  H01J9/40

    摘要： A vacuum packaging system includes a vacuum room, a delivery apparatus, a discharge device, a second heating apparatus. The delivery apparatus transport the pre-packaged container into the vacuum room. The discharge device discharges a sealing material to seal an exhaust through hole of the pre-packaged container. The discharge device includes a vessel configured for containing sealing material, a transport pipeline, a first heating, and a controlling element. The first heating apparatus softens the sealing material into viscous liquid. The second heating apparatus is mounted on the inner wall of the vacuum room between the second hatch and the transport pipeline.

    摘要翻译： 真空包装系统包括真空室，输送装置，排出装置，第二加热装置。 输送装置将预先包装的容器运送到真空室中。 排出装置排出密封材料以密封预包装容器的排气通孔。 排放装置包括构造成用于容纳密封材料，运输管线，第一加热和控制元件的容器。 第一加热装置将密封材料软化成粘性液体。 第二加热装置安装在第二舱口与运输管线之间的真空室的内壁上。

    Reference leak
    2.
    发明授权
    Reference leak 有权
    参考泄漏

    公开(公告)号：US07353687B2

    公开(公告)日：2008-04-08

    申请号：US11228821

    申请日：2005-09-16

    申请人： Jie Tang ,  Liang Liu ,  Peng Liu ,  Zhao-Fu Hu ,  Bing-Chu Du ,  Cai-Lin Guo ,  Pi-Jin Chen ,  Shou-Shan Fan

    发明人： Jie Tang ,  Liang Liu ,  Peng Liu ,  Zhao-Fu Hu ,  Bing-Chu Du ,  Cai-Lin Guo ,  Pi-Jin Chen ,  Shou-Shan Fan

    IPC分类号： G01F25/00

    CPC分类号： G01M3/007

    摘要： A reference leak includes a leak layer formed of one of a metallic material, a glass material, and a ceramic material. The metallic material is selected from the group consisting of copper, nickel, and molybdenum. The leak layer comprises a number of substantially parallel leak through holes defined therein. The leak through holes may be cylindrical holes or polyhedrical holes. A length of each of the leak through holes is preferably not less than 20 times a diameter thereof. A diameter of each of the leak through holes is generally in the range from 10 nm to 500 nm. A length of each of the leak through holes is generally in the range from 100 nm to 100 μm. A leak rate of the reference leak is in the range from 10−8 to 10−15 tor×l/s. The leak through holes have substantially same length and diameter.

    摘要翻译： 参考泄漏包括由金属材料，玻璃材料和陶瓷材料之一形成的泄漏层。 金属材料选自铜，镍和钼。 泄漏层包括限定在其中的多个基本上平行的泄漏通孔。 泄漏孔可以是圆柱形孔或多面孔。 每个泄漏通孔的长度优选不小于其直径的20倍。 每个泄漏通孔的直径通常在10nm至500nm的范围内。 每个泄漏通孔的长度通常在100nm至100μm的范围内。 参考泄漏的泄漏率在10 -8至10 -15 torxl / s的范围内。 泄漏孔具有基本相同的长度和直径。

    Vacuum packaging system
    3.
    发明授权
    Vacuum packaging system 有权
    真空包装系统

    公开(公告)号：US08087219B2

    公开(公告)日：2012-01-03

    申请号：US12469829

    申请日：2009-05-21

    申请人： Peng Liu ,  Pi-Jin Chen ,  Bing-Chu Du ,  Cai-Lin Guo ,  Liang Liu ,  Shou-Shan Fan

    发明人： Peng Liu ,  Pi-Jin Chen ,  Bing-Chu Du ,  Cai-Lin Guo ,  Liang Liu ,  Shou-Shan Fan

    IPC分类号： B65B31/00

    CPC分类号： H01J9/40 ,  H01J9/385 ,  H01J9/46

    摘要： A vacuum packaging system for packaging a vacuum apparatus includes a first accommodating room, a second container, a vacuum room, a first hatch, a second hatch, a delivery apparatus, a discharge device, and a heating apparatus. The delivery apparatus transports the vacuum apparatus from the first accommodating room to the vacuum room to the second accommodating room. The discharge device discharges a sealing element to seal an exhaust through hole of the vacuum apparatus. The heating apparatus is mounted on the inner wall of the vacuum room between the second hatch and the transport pipeline to heat and soften the sealing element.

    摘要翻译： 用于包装真空装置的真空包装系统包括第一容纳室，第二容器，真空室，第一舱口，第二舱口，输送装置，排放装置和加热装置。 输送装置将真空装置从第一容纳室输送到真空室至第二容纳室。 排出装置排出密封元件以密封真空装置的排气通孔。 加热装置安装在第二舱口与运输管线之间的真空室的内壁上，以加热和软化密封元件。

    Reference leak
    4.
    发明申请
    Reference leak 有权
    参考泄漏

    公开(公告)号：US20060144120A1

    公开(公告)日：2006-07-06

    申请号：US11228821

    申请日：2005-09-16

    申请人： Jie Tang ,  Liang Liu ,  Peng Liu ,  Zhao-Fu Hu ,  Bing-Chu Du ,  Cai-Lin Guo ,  Pi-Jin Chen ,  Shou-Shan Fan

    发明人： Jie Tang ,  Liang Liu ,  Peng Liu ,  Zhao-Fu Hu ,  Bing-Chu Du ,  Cai-Lin Guo ,  Pi-Jin Chen ,  Shou-Shan Fan

    IPC分类号： G01F25/00

    CPC分类号： G01M3/007

    摘要： A reference leak includes a leak layer formed of one of a metallic material, a glass material, and a ceramic material. The metallic material is selected from the group consisting of copper, nickel, and molybdenum. The leak layer comprises a number of substantially parallel leak through holes defined therein. The leak through holes may be cylindrical holes or polyhedrical holes. A length of each of the leak through holes is preferably not less than 20 times a diameter thereof. A diameter of each of the leak through holes is generally in the range from 10 nm to 500 nm. A length of each of the leak through holes is generally in the range from 100 nm to 100 μm. A leak rate of the reference leak is in the range from 10−8 to 10−15 tor×l/s. The leak through holes have substantially same length and diameter.

    摘要翻译： 参考泄漏包括由金属材料，玻璃材料和陶瓷材料之一形成的泄漏层。 金属材料选自铜，镍和钼。 泄漏层包括限定在其中的多个基本上平行的泄漏通孔。 泄漏孔可以是圆柱形孔或多面孔。 每个泄漏通孔的长度优选不小于其直径的20倍。 每个泄漏通孔的直径通常在10nm至500nm的范围内。 每个泄漏通孔的长度通常在100nm至100μm的范围内。 参考泄漏的泄漏率在10 -8至10 -15 torxl / s的范围内。 泄漏孔具有基本相同的长度和直径。

    Vacuum device and method for packaging same
    7.
    发明授权
    Vacuum device and method for packaging same 有权
    真空装置及其包装方法

    公开(公告)号：US08484932B2

    公开(公告)日：2013-07-16

    申请号：US12387850

    申请日：2009-05-07

    申请人： Peng Liu ,  Pi-jin Chen ,  Cai-Lin Guo ,  Bing-chu Du ,  Liang Liu ,  Shou-Shan Fan

    发明人： Peng Liu ,  Pi-jin Chen ,  Cai-Lin Guo ,  Bing-chu Du ,  Liang Liu ,  Shou-Shan Fan

    IPC分类号： B65B31/00 ,  H01J9/385

    CPC分类号： H01J9/385 ,  F16J15/108 ,  F16J15/14 ,  H01J9/40

    摘要： A method for establishing a vacuum in a container includes the following steps. The container having an exhaust through hole defined therein is provided. A sealing cover including a connecting material located on the periphery of the sealing cover is provided. The sealing cover is spaced from the exhaust through hole for form at least gaps between the sealing cover and the exhaust through hole. A vacuum is established in the container. The connecting material is heated. The sealing cover covers the exhaust through hole and the connecting material is cooled. After that the container is packaged.

    摘要翻译： 用于在容器中建立真空的方法包括以下步骤。 提供了具有限定在其中的排气通孔的容器。 提供一种包括位于密封盖周边上的连接材料的密封盖。 密封盖与排气通孔间隔开，以形成密封盖和排气通孔之间的至少间隙。 在容器中建立真空。 连接材料被加热。 密封盖覆盖排气通孔，连接材料被冷却。 之后，容器被包装。

    Vacuum device and method for packaging same
    9.
    发明申请
    Vacuum device and method for packaging same 有权
    真空装置及其包装方法

    公开(公告)号：US20090282781A1

    公开(公告)日：2009-11-19

    申请号：US12387850

    申请日：2009-05-07

    申请人： Peng Liu ,  Pi-Jin Chen ,  Cai-Lin Guo ,  Bing-Chu Du ,  Liang Liu ,  Shou-Shan Fan

    发明人： Peng Liu ,  Pi-Jin Chen ,  Cai-Lin Guo ,  Bing-Chu Du ,  Liang Liu ,  Shou-Shan Fan

    IPC分类号： B65B31/04 ,  B65D55/00

    CPC分类号： H01J9/385 ,  F16J15/108 ,  F16J15/14 ,  H01J9/40

    摘要： A method for establishing a vacuum in a container includes the following steps. The container having an exhaust through hole defined therein is provided. A sealing cover including a connecting material located on the periphery of the sealing cover is provided. The sealing cover is spaced from the exhaust through hole for forrn at least gaps between the sealing cover and the exhaust through hole. A vacuum is established in the container. The connecting material is heated. The sealing cover covers the exhaust through hole and the connecting material is cooled. After that the container is packaged.

    摘要翻译： 用于在容器中建立真空的方法包括以下步骤。 提供了具有限定在其中的排气通孔的容器。 提供一种包括位于密封盖周边上的连接材料的密封盖。 密封盖与排气通孔间隔开，用于至少在密封盖和排气通孔之间的间隙。 在容器中建立真空。 连接材料被加热。 密封盖覆盖排气通孔，连接材料被冷却。 之后，容器被包装。

    Field emission device having getter material
    10.
    发明申请
    Field emission device having getter material 有权
    具有吸气材料的场致发射装置

    公开(公告)号：US20070069631A1

    公开(公告)日：2007-03-29

    申请号：US11453453

    申请日：2006-06-14

    申请人： Cai-Lin Guo ,  Li Qian ,  Jie Tang ,  Liang Liu ,  Bing-Chu Du ,  Zhao-Fu Hu ,  Pi-Jin Chen ,  Shou-Shan Fan

    发明人： Cai-Lin Guo ,  Li Qian ,  Jie Tang ,  Liang Liu ,  Bing-Chu Du ,  Zhao-Fu Hu ,  Pi-Jin Chen ,  Shou-Shan Fan

    IPC分类号： H01J1/62

    CPC分类号： H01J29/467 ,  H01J29/94

    摘要： A field emission device (100) generally includes a front substrate (101) and a rear substrate (111) opposite thereto. The front substrate is formed with an anode (102). The rear substrate is formed with cathodes (112) facing the anode. A plurality of insulating portions (121) are formed on the rear substrate, each of which is arranged between every two neighboring cathodes. A plurality of gate electrodes are formed on top surfaces of the insulating portions 121. Each of the gate electrodes has a getter layer (123) thereon.

    摘要翻译： 场发射装置（100）通常包括与其相对的前基板（101）和后基板（111）。 前基板形成有阳极（102）。 后基板由面向阳极的阴极（112）形成。 在后基板上形成有多个绝缘部分（121），每个绝缘部分布置在每两个相邻的阴极之间。 在绝缘部分121的顶表面上形成多个栅电极。 每个栅极电极上具有吸气剂层（123）。