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1.发明授权Integrated heat spreader that maximizes heat transfer from a multi-chip package 有权集成散热器，可最大限度地提高多芯片封装的传热公开(公告)号：US09257364B2
公开(公告)日：2016-02-09
申请号：US13535257
申请日：2012-06-27
申请人： Sandeep Ahuja , Eric W. Buddrius , Roger D. Flynn , Rajat Agarwal
发明人： Sandeep Ahuja , Eric W. Buddrius , Roger D. Flynn , Rajat Agarwal
IPC分类号： H05K7/20 , H05K13/00 , G06F1/20 , H01L23/433 , H01L23/36
CPC分类号： H01L23/36 , G06F1/20 , H01L21/4882 , H01L23/433 , H01L25/0655 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H05K7/20445 , Y10T29/49002 , H01L2924/00
摘要： In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.
摘要翻译： 在至少一些实施例中，使热传递最大化的电子封装包括在基板上的多个部件。 组件上安装有加强板。 加强板具有露出部件的开口。 多个单独的集成散热器安装在部件的开口内。 第一热界面材料层（TIM1）沉积在组件和多个单独的集成散热器之间。 在至少一些实施例中，对于部件，TIM1的厚度最小化。
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公开(公告)号：US20190306985A1
公开(公告)日：2019-10-03
申请号：US15942263
申请日：2018-03-30
申请人： Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
发明人： Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
摘要： A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
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3.发明申请INTEGRATED HEAT SPREADER THAT MAXIMIZES HEAT TRANSFER FROM A MULTI-CHIP PACKAGE 有权集成散热器最大限度地从多芯片包装传输热量公开(公告)号：US20140002989A1
公开(公告)日：2014-01-02
申请号：US13535257
申请日：2012-06-27
申请人： Sandeep Ahuja , Eric W. Buddrius , Roger D. Flynn , Rajat Agarwal
发明人： Sandeep Ahuja , Eric W. Buddrius , Roger D. Flynn , Rajat Agarwal
CPC分类号： H01L23/36 , G06F1/20 , H01L21/4882 , H01L23/433 , H01L25/0655 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H05K7/20445 , Y10T29/49002 , H01L2924/00
摘要： In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.
摘要翻译： 在至少一些实施例中，使热传递最大化的电子封装包括在基板上的多个部件。 组件上安装有加强板。 加强板具有露出部件的开口。 多个单独的集成散热器安装在部件的开口内。 第一热界面材料层（TIM1）沉积在组件和多个单独的集成散热器之间。 在至少一些实施例中，对于部件，TIM1的厚度最小化。
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