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公开(公告)号:US20190306985A1
公开(公告)日:2019-10-03
申请号:US15942263
申请日:2018-03-30
申请人: Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
发明人: Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
摘要: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
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公开(公告)号:US20170179066A1
公开(公告)日:2017-06-22
申请号:US14974881
申请日:2015-12-18
申请人: Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer
发明人: Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer
CPC分类号: B23K3/029 , H01L2924/15311
摘要: Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.
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