摘要:
A resonator filter assembly is provided having a first wafer (102), a second wafer (104) and a third wafer (106). A plurality of pits are etched in the first and second wafer (102, 104) and arranged such that a plurality of resonant cavities (108) are formed with a coupling cavity (110) disposed between the resonant cavities (108). By altering the dimensions of the resonant and coupling cavities (108, 110), the frequency characteristics of the filter can be adjusted as desired.
摘要:
A packaging system for optical or optoelectronic devices having a first package of micromachined material having at least one male connection component and a second package of micromachined material having at least one female component, wherein the male connection component is configured to mate with the female connection component. A mating surface of the male component and the female component has V-grooves designed to accept a first optical fiber and a second optical fiber, wherein the first V-groove (3) is configured to align with the second V-groove (6) when the first package and second package mate, thereby passively aligning the first optical fiber (4) with the second optical fiber (8) to form a high quality fiber butt joint. Alternatively, the female component is configured to accept a photodetector, wherein the first V-groove and second V-groove passively align the first optical fiber with the photodetector.