摘要:
Compositions comprising an acidic polymer compound and a (meth)acrylic copolymer prepared from reactants comprising at least one aliphatic, aromatic, or aralkyl (meth)acrylate monomer and at least one ethylenically unsaturated monomer having a polar group or a siloxane group, and dental filling compositions comprising the composition, and methods of using the compositions
摘要:
Compositions comprising a hyperbranched compound and a polymer prepared from reactants comprising at least one (meth)acrylate monomer, and dental filling compositions comprising a hyperbranched compound.
摘要:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
摘要:
Acrylic copolymer pressure sensitive adhesive compositions containing surface-modified nanoparticles are described. The surface-modified nanoparticles are based on nanoparticles having a silica surface and a plurality of silane surface-modifying groups covalently bonded to the silica surface. Although some of the silane surface modifying groups may be non-reactive, at least 25 mole percent, and up to 100 mole percent, of the silane surface-modifying groups are reactive silane surface-modifying groups.
摘要:
A pre-adhesive syrup polymer composition is described comprising an acid-functional (meth)acrylate copolymer and an aminoalkyl (meth)acryloyl solvent monomer, which when polymerized, provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.
摘要:
A pre-adhesive syrup copolymer composition comprising an acid functional acrylate solute copolymer, a monomer solvent mixture, and a polyaziridine crosslinking agent is disclosed.
摘要:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
摘要:
A pre-adhesive syrup polymer composition is described comprising an acid-functional (meth)acrylate copolymer and an aminoalkyl (meth)acryloyl solvent monomer, which when polymerized, provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.
摘要:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
摘要:
Compositions such as photoresists and microfabrication processes are provided that can produce high-fidelity microfabricated structures. The provided photoresists can have reduced swelling during the development phase and can give tight tolerances for products, such as microneedles, that can be used, for example, in the medical field. The provided compositions include a photoresist, a photoinitiator system dispersed in the photoresist, and a polymer-tethered nanoparticle dispersed in the photoresist. The photoresist can be a negative photoresist and the photoinitiator system can include a two-photoinitiator system. The polymer-tethered nanoparticle can include an acrylic polymer and, in some embodiments, can include poly(methyl methacrylate). The nanoparticles can include silica.