-
公开(公告)号:US20210350865A1
公开(公告)日:2021-11-11
申请号:US16868402
申请日:2020-05-06
Applicant: QUALCOMM Incorporated
Inventor: Chulmin JUNG , Bin LIANG , Chi-Jui CHEN
Abstract: A method for a memory subsystem redundancy with priority decoding is described. The method includes dynamically repairing a local input/output (IO) unit of a first memory subsystem bank based on a current redundancy fuse input pattern of the first memory subsystem bank. The method also includes concurrently generating a redundancy shift signal in each global IO based on the current redundancy fuse input pattern to shift the repaired local IO unit and lower order local IO units of the first memory subsystem bank relative to the repaired local IO unit.
-
公开(公告)号:US20230317150A1
公开(公告)日:2023-10-05
申请号:US17657231
申请日:2022-03-30
Applicant: QUALCOMM Incorporated
Inventor: Chulmin JUNG , Xiao CHEN , Chi-Jui CHEN , Anil Chowdary KOTA , Dhvani SHETH
IPC: G11C11/419 , G11C11/412
CPC classification number: G11C11/419 , G11C11/412
Abstract: A memory is provided that includes bitcell VDD boosting to increase a read margin. In some implementations, the positive boost for the bitcell VDD may be provided by a capacitor that is also used for negative boosting of a write driver.
-
公开(公告)号:US20250095698A1
公开(公告)日:2025-03-20
申请号:US18469989
申请日:2023-09-19
Applicant: QUALCOMM Incorporated
Inventor: Sonia GHOSH , Xiao CHEN , Chi-Jui CHEN
Abstract: A random-access memory has its bitcells arranged into a first pair of banks and a second pair of banks. The first pair of banks and second pair of banks are separated by a central controller that contains sense amplifiers and write drivers for the first pair of banks and for the second pair of banks.
-
公开(公告)号:US20240428831A1
公开(公告)日:2024-12-26
申请号:US18340807
申请日:2023-06-23
Applicant: QUALCOMM Incorporated
Inventor: Chi-Jui CHEN , Xiao CHEN , Sonia GHOSH , Hochul LEE , Anil Chowdary KOTA , Giby SAMSON
IPC: G11C5/14 , G11C11/417
Abstract: A circuit is provided with a selectively diode-connected head switch transistor. During a light-sleep mode, the head switch transistor is diode connected so that a power supply voltage passing through the diode-connected head switch transistor is reduced by a transistor threshold voltage drop. During an active mode, the diode connection is opened so that the head switch transistor passes a power supply voltage with virtually no voltage drop.
-
-
-