公开(公告)号：US20170271175A1

公开(公告)日：2017-09-21

申请号：US15460062

申请日：2017-03-15

Applicant: QUALCOMM Incorporated

Inventor： Christopher James HEALY ,  John Patrick HOLMES ,  Michael James SOLIMANDO ,  Sun YUN ,  William Michael STONE ,  Rajendra PENDSE

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L21/563 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2924/1816 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00015

Abstract: Disclosed is a die packaging structure comprising a semiconductor die, an encapsulant layer disposed around the semiconductor die, wherein a backside surface of the semiconductor die is exposed, and a conductive layer coupled to the semiconductor die, the conductive layer comprising a plurality of conductive pillar bumps, wherein a bump density of the plurality of conductive pillar bumps is greater than 5%, wherein the encapsulant layer is further disposed between the plurality of conductive bumps, and wherein the encapsulant layer is disposed between the plurality of conductive bumps using a mold underfill (MUF) process. A method of forming the same is also disclosed.