公开(公告)号：US20170084594A1

公开(公告)日：2017-03-23

申请号：US14859321

申请日：2015-09-20

Applicant: QUALCOMM Incorporated

Inventor： Jongchil NA ,  Hong Bok WE ,  Ruey Kae ZANG

IPC: H01L25/00 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L21/4846 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/96 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311

Abstract: A die can be mounted on an already made pattern. Thereafter, substrate and other metal layers can be provided so as to embed the die in the substrate. This avoids the need to form a cavity in the substrate for die placement prevalent in conventional die embedding processes. As a result, die embedding process can be simplified. Also, die misalignment can be reduced or eliminated.