公开(公告)号：US20190028916A1

公开(公告)日：2019-01-24

申请号：US15655723

申请日：2017-07-20

Applicant: QUALCOMM Incorporated

Inventor： Rahul KASHYAP ,  Mahesh KOMMI ,  Kwangyoon LEE

IPC: H04W28/02 ,  H04W72/04

CPC classification number: H04W28/0221 ,  H04L47/824 ,  H04Q9/00 ,  H04Q2209/40 ,  H04W28/08 ,  H04W72/02 ,  H04W72/048 ,  H04W88/06

Abstract: Various additional and alternative aspects are described herein. In some aspects, the present disclosure provides a wireless device. The wireless device includes a first radio configured to communicate with a first data network. The wireless device includes a second radio configured to communicate with a second data network. The wireless device includes a thermal sensor array configured to measure a set of one or more thermal parameters associated with the wireless device. The wireless device includes a controller configured to allocate communication of data traffic between the first radio and the second radio based on the set of one or more thermal parameters.

公开(公告)号：US20170220445A1

公开(公告)日：2017-08-03

申请号：US15155113

申请日：2016-05-16

Applicant: QUALCOMM INCORPORATED

Inventor： Adam CUNNINGHAM ,  Kwangyoon LEE ,  Melanie OCLIMA

IPC: G06F11/34 ,  G06F11/30

CPC classification number: G06F11/3409 ,  G06F1/203 ,  G06F1/206 ,  G06F11/3024 ,  G06F11/3089

Abstract: Various embodiments of methods and systems for intelligent thermal power management implemented in a portable computing device (“PCD”) are disclosed. To mitigate or alleviate hysteresis associated with drastic changes in processing speeds for thermally aggressive processing components, embodiments of the solution dynamically adjust performance level floors in view of a temperature reading. Advantageously, embodiments work to manage thermal energy generation based on temperature sensor feedback that is relatively slow to detect temperature changes.