公开(公告)号：US11876085B2

公开(公告)日：2024-01-16

申请号：US17358838

申请日：2021-06-25

申请人： QUALCOMM Incorporated

发明人： Abinash Roy ,  Lohith Kumar Vemula ,  Bharani Chava ,  Jonghae Kim

IPC分类号： H01L25/16 ,  H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H01L23/64 ,  H01G4/232

CPC分类号： H01L25/16 ,  H01L21/4803 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/642 ,  H01G4/232

摘要： A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a first interconnect and a second interconnect, a capacitor located at least partially in the substrate, the capacitor comprising a first terminal and a second terminal, a first solder interconnect coupled to a first side surface of the first terminal and the first interconnect, and a second solder interconnect coupled to a second side surface of the second terminal and the second interconnect.