公开(公告)号：US20240006308A1

公开(公告)日：2024-01-04

申请号：US17855492

申请日：2022-06-30

Applicant: QUALCOMM Incorporated

Inventor： Kai LIU ,  Roy CHIU ,  Nosun PARK ,  Je-Hsiung LAN ,  Jonghae KIM

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/498 ,  H01F17/00

CPC classification number: H01L23/5227 ,  H01L23/5226 ,  H01L28/10 ,  H01L23/49827 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/002

Abstract: A device comprising a die substrate, a plurality of interconnects located over the die substrate, wherein the plurality of interconnects are configured to operate as an inductor, at least one magnetic layer that surrounds at least part of the plurality of interconnects; and at least one dielectric layer that surrounds the at least one magnetic layer.