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    TRANSFORMER WITH HIGH COMMON-MODE REJECTION RATIO (CMRR)
    1.
    发明申请
    TRANSFORMER WITH HIGH COMMON-MODE REJECTION RATIO (CMRR) 审中-公开

    公开(公告)号：US20190326872A1

    公开(公告)日：2019-10-24

    申请号：US15959824

    申请日：2018-04-23

    Applicant: QUALCOMM Incorporated

    Inventor： Haitao CHENG ,  Zhang JIN

    IPC: H03H7/42 ,  H01F27/42 ,  H01F27/29

    Abstract: Certain aspects of the present disclosure are generally directed to a structure for a balanced-unbalanced (balun) transformer. For example, certain aspects of the present disclosure provide a transformer that generally includes a first winding having a first terminal coupled to an input node and a second terminal coupled to a reference potential node. The transformer may also include a first impedance coupled between a center tap of the first winding and the reference potential node, and a second winding magnetically coupled to the first winding and having a first terminal coupled to a first differential node of a differential output pair, a second terminal coupled to a second differential node of the differential output pair, and a center tap coupled to the reference potential node.

    ON-CHIP COUPLING CAPACITOR WITH PATTERNED RADIO FREQUENCY SHIELDING STRUCTURE FOR LOWER LOSS
    3.
    发明申请
    ON-CHIP COUPLING CAPACITOR WITH PATTERNED RADIO FREQUENCY SHIELDING STRUCTURE FOR LOWER LOSS 审中-公开

    公开(公告)号：US20180366822A1

    公开(公告)日：2018-12-20

    申请号：US15687065

    申请日：2017-08-25

    Applicant: QUALCOMM Incorporated

    Inventor： Haitao CHENG ,  Zhang JIN

    IPC: H01Q1/52 ,  H01Q1/48 ,  H01Q1/22

    CPC classification number: H01Q1/526 ,  H01Q1/2283 ,  H01Q1/48

    Abstract: A capacitor radio frequency (RF) shielding structure may include a ground plane partially surrounding a coupling capacitor in an RF signal path. The ground plane may include a first ground plane portion extending between a positive terminal of the RF signal path and a negative terminal of the RF signal path. The ground plane may include a second ground plane portion extending between the positive terminal and the negative terminal of the RF signal path. The second ground plane portion may be opposed the first ground plane portion. The capacitor RF shielding structure may also include a patterned shielding layer electrically contacting the first ground plane portion and/or the second ground plane portion. The patterned shielding layer may electrically disconnecting a return current path over the patterned shielding layer to confine a return current to flowing over the first ground plane portion or the second ground plane portion.

    TECHNIQUES FOR LOW-LOSS MULTI-BAND MULTIPLEXING
    4.
    发明申请
    TECHNIQUES FOR LOW-LOSS MULTI-BAND MULTIPLEXING 审中-公开

    公开(公告)号：US20180205413A1

    公开(公告)日：2018-07-19

    申请号：US15872695

    申请日：2018-01-16

    Applicant: QUALCOMM Incorporated

    Inventor： Chirag Dipak PATEL ,  Lai Kan LEUNG ,  Zhang JIN ,  Chinmaya MISHRA ,  Ravi SRIDHARA ,  Youngchang YOON

    IPC: H04B1/44 ,  H04W72/04 ,  H04L5/14 ,  H03F1/48 ,  H03F3/19 ,  H03F3/24 ,  H03F1/56

    Abstract: Various aspects described herein relate to low-loss multi-band multiplexing schemes for a wireless communications system, for example, a 5th Generation (5G) New Radio (NR) system. In an aspect, a multiplexer for multi-band wireless communications comprises at least one tuning component configured to transmit or receive at least one signal within a frequency band that is selected from a plurality of frequency bands. The multiplexer further comprises at least one combining component, communicatively coupled with the at least one tuning component, configured to transmit or receive the at least one signal within the selected frequency band. In an aspect, the at least one tuning component is integrated on a chip and the at least one combining component is not integrated on the chip.

    DIVIDED RING FOR COMMON-MODE (CM) AND DIFFERENTIAL-MODE (DM) ISOLATION
    5.
    发明申请
    DIVIDED RING FOR COMMON-MODE (CM) AND DIFFERENTIAL-MODE (DM) ISOLATION 审中-公开
    用于通用模式（CM）和差分模式（DM）隔离的分离环

    公开(公告)号：US20160365189A1

    公开(公告)日：2016-12-15

    申请号：US14737611

    申请日：2015-06-12

    Applicant: QUALCOMM Incorporated

    Inventor： Zhang JIN ,  Yung-Chung LO ,  Youngchang YOON ,  Ning YUAN ,  Apsara RAVISH SUVARNA

    IPC: H01F27/28 ,  H04B15/02

    CPC classification number: H04B15/02 ,  H01F27/362 ,  H01F2017/0093 ,  H01L23/5225 ,  H01L23/5227 ,  H04B3/28

    Abstract: Certain aspects of the present disclosure provide techniques and apparatus employing an isolation ring having a center strip of conductive material used to isolate magnetic fields generated by common-mode and differential-mode current flow through one or more inductors disposed in the ring. The apparatus generally includes an electrical component having an inductive element and a ring of electrically conductive material encircling the inductive element, wherein the ring has a strip of electrically conductive material disposed in the ring and connecting a first point on the ring to a second point on the ring.

    Abstract translation: 本公开的某些方面提供使用隔离环的技术和装置，所述隔离环具有用于隔离通过设置在环中的一个或多个电感器的共模和差模电流产生的磁场的导电材料的中心条。 该装置通常包括具有感应元件的电气元件和环绕感应元件的导电材料环，其中环具有设置在环中的导电材料条，并将环上的第一点连接到第二点上 戒指。

    ANTENNA MODULE WITH A VERTICAL DIPOLE ANTENNA TO COVER A BROADSIDE RADIATION PATTERN
    7.
    发明申请
    ANTENNA MODULE WITH A VERTICAL DIPOLE ANTENNA TO COVER A BROADSIDE RADIATION PATTERN 审中-公开

    公开(公告)号：US20180301791A1

    公开(公告)日：2018-10-18

    申请号：US15953236

    申请日：2018-04-13

    Applicant: Qualcomm Incorporated

    Inventor： Zhang JIN ,  Jeong II Kim

    IPC: H01Q1/24 ,  H01Q9/18 ,  H01Q9/26

    Abstract: Certain aspects of the present disclosure generally relate to wireless communication. In some aspects, an antenna module may include a substrate; a first dipole antenna positioned such that conductive components of the first dipole antenna are oriented on a first plane that is approximately parallel to a mounting surface of the substrate; and a second dipole antenna positioned such that conductive components of the second dipole antenna are oriented on a second plane that is approximately perpendicular to the mounting surface of the substrate, wherein the second dipole antenna is positioned to cover a broadside radiation pattern approximately perpendicular to the mounting surface. Numerous other aspects are provided.

    FOLDED METAL-OXIDE-METAL CAPACITOR OVERLAPPED BY ON-CHIP INDUCTOR/TRANSFORMER
    9.
    发明申请
    FOLDED METAL-OXIDE-METAL CAPACITOR OVERLAPPED BY ON-CHIP INDUCTOR/TRANSFORMER 审中-公开

    公开(公告)号：US20190259701A1

    公开(公告)日：2019-08-22

    申请号：US16006657

    申请日：2018-06-12

    Applicant: QUALCOMM Incorporated

    Inventor： Haitao CHENG ,  Zhang JIN

    IPC: H01L23/522 ,  H01L23/528 ,  H01L49/02

    Abstract: An integrated circuit includes a capacitor (e.g., a folded metal-oxide-metal (MOM) capacitor) formed in the lower BEOL interconnect levels, without degrading an inductor's Q-factor. The integrated circuit includes the capacitor in one or more back-end-of-line (BEOL) interconnect levels. The capacitor includes multiple folded capacitor fingers having multiple sides and a pair of manifolds on a same side of the folded capacitor fingers. Each of the pair of manifolds is coupled to one or more of the folded capacitor fingers. The integrated circuit also includes an inductive trace having one or more turns in one or more different BEOL interconnect levels. The inductive trace overlaps one or more portions of the capacitor.

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