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    PIEZOELECTRIC MEMS CONTACT DETECTION SYSTEM
    1.
    发明申请
    PIEZOELECTRIC MEMS CONTACT DETECTION SYSTEM 有权

    公开(公告)号：US20250056164A1

    公开(公告)日：2025-02-13

    申请号：US18718427

    申请日：2023-03-02

    Applicant: QUALCOMM Technologies, Inc.

    Inventor： Robert John LITTRELL

    IPC: H04R17/00

    Abstract: Systems, devices, methods, and implementations related to contact detection are described herein. In one aspect, a system is provided. The system includes a first piezoelectric microelectromechanical systems (MEMS) transducer coupled to configured to generate a first analog signal when the first analog signal is transduced from vibrations propagating through the object. The system includes a second piezoelectric MEMS transducer having configured to generate a second analog signal transduced from acoustic vibrations at a location of the object, and classification circuitry coupled to the output of first piezoelectric MEMS transducer and the output of the second piezoelectric MEMS transducer, where the classification circuitry is configured to process data from the first analog signal and data from the second analog signal, and to categorize combinations of the first analog signal and the second analog signal received during one or more time frames.

    PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCER (PMUT) DESIGN
    3.
    发明公开
    PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCER (PMUT) DESIGN 审中-公开

    公开(公告)号：US20230270012A1

    公开(公告)日：2023-08-24

    申请号：US18174548

    申请日：2023-02-24

    Applicant: QUALCOMM Technologies, Inc.

    Inventor： Robert John LITTRELL

    IPC: H10N30/20 ,  H10N30/87

    CPC classification number: H10N30/2044 ,  H10N30/875

    Abstract: Aspects include piezoelectric acoustic transducers and systems for acoustic transduction. In some aspects, an acoustic transducer is structured with a silicon substrate having a top surface and a bottom surface, where the top surface has a first portion and an edge along the first portion associated with an acoustic aperture. The transducer has a first silicon oxide layer disposed over the first portion of the top surface of the silicon substrate, a polysilicon layer disposed over the first silicon oxide layer, and a second silicon oxide layer disposed over the polysilicon layer. A cantilevered beam comprising a fixed end, a deflection end, a top surface, and a bottom surface, has a first portion of the bottom surface at the fixed end disposed over the second silicon oxide layer, where a second portion of the bottom surface at the deflection end is formed over the acoustic aperture. In some aspects. transducer elements are reconfigurable between parallel and serial configurations depending on a system operating mode.

    PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCER (PMUT) DESIGN
    4.
    发明公开
    PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCER (PMUT) DESIGN 审中-公开

    公开(公告)号：US20230270011A1

    公开(公告)日：2023-08-24

    申请号：US18174536

    申请日：2023-02-24

    Applicant: QUALCOMM Technologies, Inc.

    Inventor： Robert John LITTRELL

    IPC: H10N30/20 ,  B81B3/00 ,  H10N30/50 ,  H10N30/853

    CPC classification number: H10N30/2042 ,  B81B3/0021 ,  H10N30/503 ,  H10N30/853 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/04

    Abstract: Aspects include piezoelectric acoustic transducers and systems for acoustic transduction. In some aspects, an acoustic transducer is structured with a silicon substrate having a top surface and a bottom surface, where the top surface has a first portion and an edge along the first portion associated with an acoustic aperture. The transducer has a first silicon oxide layer disposed over the first portion of the top surface of the silicon substrate, a polysilicon layer disposed over the first silicon oxide layer, and a second silicon oxide layer disposed over the polysilicon layer. A cantilevered beam comprising a fixed end, a deflection end, a top surface, and a bottom surface, has a first portion of the bottom surface at the fixed end disposed over the second silicon oxide layer, where a second portion of the bottom surface at the deflection end is formed over the acoustic aperture. In some aspects. transducer elements are reconfigurable between parallel and serial configurations depending on a system operating mode.

    ACOUSTIC TRANSDUCER WITH IMPROVED LOW-FREQUENCY RESPONSE
    6.
    发明公开
    ACOUSTIC TRANSDUCER WITH IMPROVED LOW-FREQUENCY RESPONSE 审中-公开

    公开(公告)号：US20230143656A1

    公开(公告)日：2023-05-11

    申请号：US18053669

    申请日：2022-11-08

    Applicant: QUALCOMM Technologies, Inc.

    Inventor： Robert John LITTRELL

    IPC: B81B3/00

    CPC classification number: B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/04

    Abstract: Aspects of acoustic transducers are described. One aspect is a microelectromechanical (MEMS) transducer comprising a substrate and multiple cantilevered beams. A first cantilevered beam comprises a first protrusion and a first piezoelectric structure, where the first piezoelectric structure comprises a first deflection end and a first fixed end, where the first fixed end is coupled to the substrate, and where the first deflection end is cantilevered away from the substrate. The first cantilevered beam is separated from a second cantilevered beam by a gap. The first protrusion is disposed at the first deflection end and increases a thickness of the first cantilevered beam along the gap at the first deflection end. A second protrusion of the second beam is disposed at a second deflection end and increases a thickness of the second cantilevered beam along the gap at the second deflection end.

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