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58 条记录 (耗时 0.031 秒)

    Planarization process for thin film surfaces
    1.
    发明授权
    Planarization process for thin film surfaces 失效
    薄膜表面平面化处理

    公开(公告)号：US06922890B2

    公开(公告)日：2005-08-02

    申请号：US10295382

    申请日：2002-11-15

    申请人： Qing Dai ,  Jennifer Qing Lu ,  Dennis Richard McKean ,  Eun Row ,  Li Zheng

    发明人： Qing Dai ,  Jennifer Qing Lu ,  Dennis Richard McKean ,  Eun Row ,  Li Zheng

    IPC分类号： G11B5/10 ,  G11B5/31 ,  G11B5/60 ,  H04R31/00 ,  H05K3/30

    CPC分类号： G11B5/6005 ,  G11B5/3106 ,  G11B5/3163 ,  G11B5/3169 ,  G11B5/3173 ,  Y10S438/976 ,  Y10T29/49023 ,  Y10T29/49041 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T29/49192 ,  Y10T29/4922 ,  Y10T29/49224 ,  Y10T156/1082 ,  Y10T156/1153

    摘要： A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

    摘要翻译： 提供了一种使结构平坦化的方法，其最小化步骤高度，减少工艺步骤，改善清洁度，并提供增加的脱粘方便性。 将结构放置在工作表面朝下的粘合剂层上，使得结构在加热期间保持固定。 使用双层封装膜来实现平坦化。 载体用热塑性薄膜层，然后是化学惰性的保护性聚合物薄膜层进行双层叠，可以承受蚀刻和清洁过程。 热塑性层层压在载体的顶部上; 聚合物层层压在接合的热塑性层和载体的顶部上。 然后将具有双层膜的载体放置在结构的背面，以防止在光带期间从正面的化学侵蚀并且使得能够平坦化。 当施加热量时，双层包封膜熔化并将聚合物层推入结构之间的间隙，从而实现完全平坦化。

    Planarization method for a structure having a first surface for etching and a second surface
    2.
    发明授权
    Planarization method for a structure having a first surface for etching and a second surface 失效
    具有用于蚀刻的第一表面和第二表面的结构的平面化方法

    公开(公告)号：US07263763B2

    公开(公告)日：2007-09-04

    申请号：US11168215

    申请日：2005-06-27

    申请人： Qing Dai ,  Jennifer Qing Lu ,  Dennis Richard McKean ,  Eun Row ,  Li Zheng

    发明人： Qing Dai ,  Jennifer Qing Lu ,  Dennis Richard McKean ,  Eun Row ,  Li Zheng

    IPC分类号： G11B5/127 ,  H04R31/00

    CPC分类号： G11B5/6005 ,  G11B5/3106 ,  G11B5/3163 ,  G11B5/3169 ,  G11B5/3173 ,  Y10S438/976 ,  Y10T29/49023 ,  Y10T29/49041 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T29/49192 ,  Y10T29/4922 ,  Y10T29/49224 ,  Y10T156/1082 ,  Y10T156/1153

    摘要： A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

    摘要翻译： 提供了一种使结构平坦化的方法，其最小化步骤高度，减少工艺步骤，改善清洁度，并提供增加的脱粘方便性。 将结构放置在工作表面朝下的粘合剂层上，使得结构在加热期间保持固定。 使用双层封装膜来实现平坦化。 载体用热塑性薄膜层，然后是化学惰性的保护性聚合物薄膜层进行双层叠，可以承受蚀刻和清洁过程。 热塑性层层压在载体的顶部上; 聚合物层层压在接合的热塑性层和载体的顶部上。 然后将具有双层膜的载体放置在结构的背面，以防止在光带期间从正面的化学侵蚀并且使得能够平坦化。 当施加热量时，双层包封膜熔化并将聚合物层推入结构之间的间隙，从而实现完全平坦化。

    System, method and apparatus for pattern clean-up during fabrication of patterned media using forced assembly of molecules
    4.
    发明授权
    System, method and apparatus for pattern clean-up during fabrication of patterned media using forced assembly of molecules 失效
    使用强制组装分子的图案化介质制造期间图案清理的系统，方法和装置

    公开(公告)号：US08481245B2

    公开(公告)日：2013-07-09

    申请号：US13333109

    申请日：2011-12-21

    申请人： Qing Dai ,  Dan Saylor Kercher ,  Huey-Ming Tzeng

    发明人： Qing Dai ,  Dan Saylor Kercher ,  Huey-Ming Tzeng

    IPC分类号： G03F7/20

    CPC分类号： G03F7/40 ,  B82Y10/00 ,  G11B5/743 ,  G11B5/82 ,  G11B5/855

    摘要： A pattern clean-up for fabrication of patterned media using a forced assembly of molecules is disclosed. E-beam lithography is initially used to write the initial patterned bit media structures, which have size and positioning errors. Nano-sized protein molecules are then forced to assemble of on top of the bits. The protein molecules have a very uniform size distribution and assemble into a lattice structure above the e-beam patterned areas. The protein molecules reduce the size and position errors in e-beam patterned structures. This process cleans the signal from the e-beam lithography and lowers the noise in the magnetic reading and writing. This process may be used to fabricate patterned bit media directly on hard disk, or to create a nano-imprint master for mass production of patterned bit media disks.

    摘要翻译： 公开了使用分子的强制组装制造图案化介质的图案清理。 电子束光刻最初用于写入具有尺寸和定位误差的初始图案化的位介质结构。 然后将纳米级蛋白质分子强制装配在顶部的位上。 蛋白质分子具有非常均匀的尺寸分布并且组装成电子束图案区域上方的晶格结构。 蛋白质分子减小电子束图案结构中的尺寸和位置误差。 该过程清除电子束光刻中的信号，并降低磁读取和写入中的噪声。 该过程可用于直接在硬盘上制造图案化的位介质，或者用于创建用于批量生产图案化位媒体盘的纳米压印母版。

    PERPENDICULAR MAGNETIC RECORDING MEDIA HAVING A CAP LAYER FORMED FROM A CoPtCr ALLOY
    5.
    发明申请
    PERPENDICULAR MAGNETIC RECORDING MEDIA HAVING A CAP LAYER FORMED FROM A CoPtCr ALLOY 审中-公开
    具有CoPtCr合金形成的CAP层的全磁性记录介质

    公开(公告)号：US20100073813A1

    公开(公告)日：2010-03-25

    申请号：US12233959

    申请日：2008-09-19

    申请人： Qing Dai ,  Mohammad T. Mirzamaani ,  Kai Tang ,  Jinliu Wang

    发明人： Qing Dai ,  Mohammad T. Mirzamaani ,  Kai Tang ,  Jinliu Wang

    IPC分类号： G11B5/127 ,  G11B5/706 ,  G11B5/65 ,  G11B5/66 ,  B05D5/12

    CPC分类号： G11B5/66 ,  G11B5/65

    摘要： Perpendicular magnetic recording (PMR) media and methods of fabricating PMR media are described. The PMR media includes, among other layers, a perpendicular magnetic recording layer and a cap layer that are exchange coupled. The magnetic recording layer and the cap layer may be exchange coupled through direct contact, or may be exchange coupled over a coupling layer. In either embodiment, the cap layer is formed from a CoPtCr alloy having a concentration of Cr in the range of about 15-22 at %.

    摘要翻译： 描述了垂直磁记录（PMR）介质和制造PMR介质的方法。 除了其它层之外，PMR介质包括交换耦合的垂直磁记录层和盖层。 磁记录层和盖层可以通过直接接触交换耦合，或者可以通过耦合层交换耦合。 在任一实施例中，盖层由Cr浓度在约15-22at％范围内的CoPtCr合金形成。

    "> Perpendicular Magnetic recording system and medium with high-moment corrosion-resistant
    6.
    发明申请
    Perpendicular Magnetic recording system and medium with high-moment corrosion-resistant "soft" underlayer (SUL) 审中-公开
    垂直磁记录系统和高强度耐腐蚀“软”底层（SUL）

    公开(公告)号：US20090213494A1

    公开(公告)日：2009-08-27

    申请号：US12387091

    申请日：2009-04-27

    申请人： Qing Dai ,  Bernd Heinz ,  Yoshihiro Ikeda ,  Mary Frances Minardi ,  Kentaro Takano

    发明人： Qing Dai ,  Bernd Heinz ,  Yoshihiro Ikeda ,  Mary Frances Minardi ,  Kentaro Takano

    IPC分类号： G11B5/127 ,  G11B5/66 ,  G11B5/65

    CPC分类号： G11B5/667 ,  G11B5/7379

    摘要： A perpendicular magnetic recording disk has a soft magnetic underlayer (SUL) that has high corrosion resistance as well as high moment. The material of the SUL is an alloy comprising Co, Fe, X, and Y; where X is Ta or Nb, Y is Zr or Hf, and the combined amount of X and Y present in the alloy is between about 10 and 20 atomic percent. The atomic ratio of Co to Fe in the alloy is between about 90:10 to 10:90, preferably between about 25:75 and 35:65. The SUL may be a single-layer SUL or a multilayer SUL formed of multiple soft magnetic layers separated by an interlayer film or films.

    摘要翻译： 垂直磁记录盘具有高耐蚀性和高力矩的软磁性底层（SUL）。 SUL的材料是包括Co，Fe，X和Y的合金; 其中X是Ta或Nb，Y是Zr或Hf，合金中存在的X和Y的组合量在约10和20原子％之间。 合金中Co与Fe的原子比为约90:10至10:90，优选约25:75至35:65。 SUL可以是由层间膜或膜分离的多个软磁层形成的单层SUL或多层SUL。

    Soft underlayer for perpendicular media with mechanical stability and corrosion resistance
    7.
    发明申请
    Soft underlayer for perpendicular media with mechanical stability and corrosion resistance 审中-公开
    用于垂直介质的软底层具有机械稳定性和耐腐蚀性

    公开(公告)号：US20080090106A1

    公开(公告)日：2008-04-17

    申请号：US11580648

    申请日：2006-10-13

    申请人： David Braunstein ,  Qing Dai ,  Yoshihiro Ikeda ,  Ernesto Marinero ,  Run-Han Wang

    发明人： David Braunstein ,  Qing Dai ,  Yoshihiro Ikeda ,  Ernesto Marinero ,  Run-Han Wang

    IPC分类号： G11B5/66

    CPC分类号： G11B5/667

    摘要： A perpendicular magnetic recording disk has a granular cobalt alloy recording layer (RL) containing on the “soft” magnetic underlayer (SUL). The SUL is doped with judiciously chosen elements or alloys or is capped or intercalated with said elements or metal alloy layers. The resulting disk and the SUL in particular has good recording properties, improved mechanical strength and improved corrosion resistance over a comparable disk without the doping or thin layers.

    摘要翻译： 垂直磁记录盘具有包含在“软”磁性底层（SUL）上的颗粒状钴合金记录层（RL）。 SUL掺杂有明智选择的元素或合金，或者被封盖或嵌入所述元件或金属合金层。 所得到的盘和SUL特别具有良好的记录性能，改善的机械强度和在不具有掺杂或薄层的相当的盘上提高的耐腐蚀性。