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公开(公告)号:US11812665B1
公开(公告)日:2023-11-07
申请号:US16402265
申请日:2019-05-03
Applicant: QorTek, Inc.
Inventor: Ahmet Erkan Gurdal , Sinan Dursun , Safakcan Tuncdemir , Clive Randall
IPC: H01L41/107 , C04B35/499 , C04B35/622 , C04B35/64 , H10N30/40 , H10N30/053 , H10N30/50 , H10N30/87 , H10N30/853
CPC classification number: H10N30/40 , C04B35/499 , C04B35/62222 , C04B35/64 , H10N30/053 , H10N30/505 , H10N30/8554 , H10N30/871 , H10N30/872 , H10N30/877 , C04B2235/3203 , C04B2235/3234 , C04B2235/3255 , C04B2235/326 , C04B2235/3267 , C04B2235/3296 , C04B2235/442
Abstract: A composition includes at least one Pb/Ni/Nb - Pb/Mg/W - Pb/Zr/Ti mixed oxide. A piezoelectric device may be made by providing at least two layers comprising the composition and coated with an outer electrode material; providing a plurality of layers comprising the composition and coated with an inner electrode material; combining or stacking a plurality of layers coated with inner electrode materials between two outer electrodes; and sintering or co-firing the inner electrode materials and outer electrode materials at a temperature at or below about 1000° C.
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公开(公告)号:US12048247B1
公开(公告)日:2024-07-23
申请号:US17146340
申请日:2021-01-11
Applicant: QorTek, Inc. , Clive A. Randall
Inventor: Wei-Ting Chen , Safakcan Tuncdemir , Ahmet E. Gurdal , Gareth J. Knowles , Clive A. Randall
IPC: H10N30/00 , H10N30/057 , H10N30/50 , H10N30/853 , H10N30/87
CPC classification number: H10N30/1071 , H10N30/057 , H10N30/50 , H10N30/853 , H10N30/8536 , H10N30/8542 , H10N30/8554 , H10N30/8561 , H10N30/874 , H10N30/877
Abstract: A wire-free multilayer biomorph device is provided where the layers are bonded without use of adhesive. The device includes a plurality of stacked perforated metal plates with interposed transductive assembly layers. The perforated metal plates and transductive assembly layers are bonded by a conductive metal ink that is subject to a thermal cycle process. Electrical connection of the perforated metal plates and transductive assembly are realized through structural connectors thru-connectors thereby obviating the need for wiring.
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公开(公告)号:US09983234B2
公开(公告)日:2018-05-29
申请号:US15125054
申请日:2015-03-10
Applicant: Qortek, Inc.
Inventor: Gareth J. Knowles , William M. Bradley , Jonathan M. Zook , Ross Bird , Safakcan Tuncdemir
CPC classification number: G01R15/183 , G01L1/127 , G01L1/2206 , G01R15/18 , G01R33/0052 , H01L41/12
Abstract: A non-contact, current sensor includes a gapped magnetic core configured to circumscribe a current carrying conductor. A magnetostrictive element is mechanically coupled to the gapped magnetic core. Current flowing in the current carrying conductor induces a magnetic field in the magnetic core that flows through the magnetostrictive element. The gapped magnetic core is provided with mounting sections to which the magnetostrictive element is mechanically coupled. The mounting sections have a geometry that increases magnetic flux in the magnetostrictive element. A strain gauge is mechanically coupled to the magnetostrictive element to measure displacement in the element induced by the magnetic flux.
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公开(公告)号:US20170074906A1
公开(公告)日:2017-03-16
申请号:US15125054
申请日:2015-03-10
Applicant: Qortek, Inc.
Inventor: Gareth J. Knowles , William M. Bradley , Jonathan M. Zook , Ross Bird , Safakcan Tuncdemir
CPC classification number: G01R15/183 , G01L1/127 , G01L1/2206 , G01R15/18 , G01R33/0052 , H01L41/12
Abstract: A non-contact, current sensor includes a gapped magnetic core configured to circumscribe a current carrying conductor. A magnetostrictive element is mechanically coupled to the gapped magnetic core. Current flowing in the current carrying conductor induces a magnetic field in the magnetic core that flows through the magnetostrictive element. The gapped magnetic core is provided with mounting sections to which the magnetostrictive element is mechanically coupled. The mounting sections have a geometry that increases magnetic flux in the magnetostrictive element. A strain gauge is mechanically coupled to the magnetostrictive element to measure displacement in the element induced by the magnetic flux.
Abstract translation: 非接触式电流传感器包括配置成围绕载流导体的间隙磁芯。 磁致伸缩元件机械耦合到有间隙的磁芯。 在载流导体中流动的电流在磁芯中的磁场中产生流过磁致伸缩元件的磁场。 有间隙的磁芯设有安装部分,磁致伸缩元件机械耦合到该安装部分。 安装部分具有增加磁致伸缩元件中的磁通量的几何形状。 应变计机械耦合到磁致伸缩元件以测量由磁通量引起的元件中的位移。
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