Guide holders for engaging a motherboard sled with an input-output sled stacked thereon

    公开(公告)号:US11683904B2

    公开(公告)日:2023-06-20

    申请号:US17407882

    申请日:2021-08-20

    CPC classification number: H05K7/1489 H05K7/1487

    Abstract: Guide holders for engaging a motherboard sled with an input-output sled stacked thereon within an electronic chassis, are disclosed. The electronic chassis includes a motherboard sled having a housing having a first sidewall and a second sidewall opposite to the first sidewall, a first guide holder and a second guide holder. The first guide holder is coupled to the first sidewall and includes a first plurality of slots for directing motion of a first plurality of guide pins of an input-output sled in a predetermined direction. The second guide holder is coupled to the second sidewall and includes a second plurality of slots for directing motion of a second plurality of guide pins of the input-output sled in the predetermined direction. The motion of the first plurality of guide pins and the second plurality of guide pins, upon completion, locks the input-output sled to the motherboard sled.

    Tool-less M.2 device carrier with grounding and thermal flow

    公开(公告)号:US11553625B2

    公开(公告)日:2023-01-10

    申请号:US16950551

    申请日:2020-11-17

    Abstract: A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

    Chassis power supply reception
    4.
    发明授权

    公开(公告)号:US11382237B1

    公开(公告)日:2022-07-05

    申请号:US17136415

    申请日:2020-12-29

    Abstract: A computer chassis can include an airflow channel for permitting airflow specifically to cool one or more power supply units (PSUs) within respective power supply receiving space(s). The chassis can include a baffle device positioned between the power supply receiving space and the airflow channel for directing airflow through the PSU into the airflow channel. The airflow channel can be located between first and second spaces of the chassis, each containing computing components. The baffle device can include a cable passthrough that receives a cable that facilitates communication between component(s) in the first space and component(s) in the second space. The baffle device can include one or more ribs that stop the PSU from being fully inserted into the power supply receiving space when the PSU is inserted in an incorrect orientation, thus signaling to the user to remove the PSU and re-insert it in a correct orientation.

    Mechanical actuators for engaging a motherboard sled with a chassis

    公开(公告)号:US11558976B2

    公开(公告)日:2023-01-17

    申请号:US17407887

    申请日:2021-08-20

    Abstract: An electronic chassis includes a motherboard sled configured to engage in or out of the electronic chassis. The motherboard sled includes a housing and a mechanical actuator for engaging the motherboard sled into or out of an electronic chassis. The mechanical actuator includes at least one lever rotatably coupled to a hinge to form a first fulcrum adjacent to a vertical edge of a front surface of the housing. The mechanical actuator also includes a guiding arm adjacent to the hinge and mechanically connected to the at least one lever to form a second fulcrum. The guiding arm rotates between a secured position adjacent to the front surface and an unsecured position away from the front surface.

    Tool-less latch system for a node sled

    公开(公告)号:US11197384B1

    公开(公告)日:2021-12-07

    申请号:US16948206

    申请日:2020-09-08

    Abstract: A node sled is for installation into an electronics chassis. The node sled includes a housing that contains electronic components. The housing includes a front bracket and a catch mechanism. The node sled further includes a lever having an engagement arm, an actuation arm, and a mounting portion. The mounting portion is pivotably mounted to the housing. The actuation arm is manually moveable between a first position in which the engagement arm locks the node sled into the electronics chassis, and a second position in which the engagement arm is released from the electronics chassis. The actuation arm has a latch that engages the catch mechanism in response to the actuation arm being in the first position.

    Removable BMC carrier module
    7.
    发明授权

    公开(公告)号:US11144100B2

    公开(公告)日:2021-10-12

    申请号:US16858152

    申请日:2020-04-24

    Abstract: A baseboard management controller (BMC) carrier module that contains a BMC carrier bracket and a thumb screw is disclosed. The BMC carrier bracket has a back plate, a top plate, a side plate, and a corner plate. The corner plate includes a first section and a second section. The second section of the corner plate extends perpendicularly from the first section of the corner plate. The BMC carrier bracket is configured to receive a BMC board between the first section of the corner plate and the side plate. The BMC board includes an aperture to receive a screw to secure the BMC board to the BMC carrier bracket, at a distance from the back plate. The thumb screw is coupled to the second section of the corner plate of the BMC carrier bracket, and is configured to bias a memory carrier module against the side plate.

    REMOVABLE BMC CARRIER MODULE
    8.
    发明申请

    公开(公告)号:US20210232188A1

    公开(公告)日:2021-07-29

    申请号:US16858152

    申请日:2020-04-24

    Abstract: A baseboard management controller (BMC) carrier module that contains a BMC carrier bracket and a thumb screw is disclosed. The BMC carrier bracket has a back plate, a top plate, a side plate, and a corner plate. The corner plate includes a first section and a second section. The second section of the corner plate extends perpendicularly from the first section of the corner plate. The BMC carrier bracket is configured to receive a BMC board between the first section of the corner plate and the side plate. The BMC board includes an aperture to receive a screw to secure the BMC board to the BMC carrier bracket, at a distance from the back plate. The thumb screw is coupled to the second section of the corner plate of the BMC carrier bracket, and is configured to bias a memory carrier module against the side plate.

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