公开(公告)号：US20240179875A1

公开(公告)日：2024-05-30

申请号：US18435866

申请日：2024-02-07

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Sin-Hong LIEN ,  Jen-Mao CHEN

IPC: H05K7/20

CPC classification number: H05K7/20663 ,  H05K7/20327 ,  H05K7/20354 ,  H05K7/202

Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

公开(公告)号：US20220346282A1

公开(公告)日：2022-10-27

申请号：US17393725

申请日：2021-08-04

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu Nien HUANG ,  Sin-Hong LIEN

IPC: H05K7/20

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.

公开(公告)号：US20220354022A1

公开(公告)日：2022-11-03

申请号：US17387415

申请日：2021-07-28

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu Nien HUANG ,  Sin-Hong LIEN ,  Jen-Mao CHEN

IPC: H05K7/20

Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

公开(公告)号：US20220408593A1

公开(公告)日：2022-12-22

申请号：US17353301

申请日：2021-06-21

Applicant: Quanta Computer Inc.

Inventor： Jen-Mao CHEN ,  Wei-En TSAI ,  Sin-Hong LIEN ,  Jhih-Bin GUAN

IPC: H05K7/20

Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position tank, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

公开(公告)号：US20230068535A1

公开(公告)日：2023-03-02

申请号：US17514479

申请日：2021-10-29

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Sin-Hong LIEN ,  Jen-Mao CHEN

IPC: G06F1/20 ,  H05K7/20

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

公开(公告)号：US20220279677A1

公开(公告)日：2022-09-01

申请号：US17186509

申请日：2021-02-26

Applicant: QUANTA COMPUTER INC.

Inventor： Jen-Mao CHEN ,  Shao-Yu CHEN ,  Sin-Hong LIEN

IPC: H05K7/20 ,  H05K1/02

Abstract: Embodiments of the disclosure relate to active cooling devices for cooling an electronic assembly positioned downstream in a computing system. In one embodiment, an electronic assembly positioned downstream of the computing system is disclosed. The electronic assembly includes a printed circuit board electrically connected to the computing system; an air duct disposed over the printed circuit board; and an active cooling device thermally coupled to the printed circuit board. The printed circuit board includes a transceiver socket configured to receive at least one optical transceiver and one or more heat-generating components disposed thereon. The at least one optical transceiver is configured to mate with an active optical cable.