公开(公告)号：US20240322446A1

公开(公告)日：2024-09-26

申请号：US18126142

申请日：2023-03-24

Applicant: Raytheon Company

Inventor： Channing P. Favreau ,  John P. Haven ,  Randy T. Camasso

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q21/06 ,  H01Q23/00

CPC classification number: H01Q21/0025 ,  H01Q1/22 ,  H01Q21/061 ,  H01Q23/00

Abstract: A conformal antenna device is provided that includes a conformance panel, an antenna array, a combiner board, and a plurality of slats. The conformance panel has an inner radial surface, an outer radial surface, a width extending between first and second axial ends, and a length extending between first and second lateral ends. The conformance panel extends linearly in a widthwise direction and extends arcuately in a lengthwise direction. The conformance panel includes a plurality of apertures extending between the inner and outer radial surfaces. The antenna array is attached to the outer radial surface. The slats extend between the combiner board and the conformance panel in a spoke arrangement. Each slat includes a first plate and a second plate, and each second plate includes electrical circuitry and one or more components and is in signal communication with the antenna array.

公开(公告)号：US11949216B2

公开(公告)日：2024-04-02

申请号：US17658344

申请日：2022-04-07

Applicant: Raytheon Company

Inventor： Channing P. Favreau ,  Alexander Gilbert ,  Thomas V. Sikina

IPC: H02G15/10 ,  H05K5/02

CPC classification number: H02G15/10 ,  H05K5/0247

Abstract: Methods and apparatus for a housing assembly including a housing comprising a conductive material, a conductor extending through the housing, and a dielectric material at least partially surrounding the conductor. Portions of the housing may surround the conductor such that the conductor, the dielectric, and the portions of the housing form a channel through the housing.

公开(公告)号：US20210359429A1

公开(公告)日：2021-11-18

申请号：US16874790

申请日：2020-05-15

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  Channing P. Favreau

IPC: H01Q23/00 ,  H01Q9/04 ,  H01Q1/48 ,  H01L23/66

Abstract: Methods and apparatus for providing a radiator having an antenna comprising a patch antenna layer and a first ground plane layer, wherein the antenna has a reactive field region of the radiator between the patch antenna layer and the first ground plane layer, and an integrated circuit located in the active region.

公开(公告)号：US11990677B2

公开(公告)日：2024-05-21

申请号：US17200155

申请日：2021-03-12

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  Channing P. Favreau ,  Erika Klek

IPC: H01Q21/00 ,  H01Q21/24 ,  H05K1/02

CPC classification number: H01Q21/0025 ,  H01Q21/24 ,  H05K1/0243 ,  H05K2201/10098

Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.

公开(公告)号：US20220294123A1

公开(公告)日：2022-09-15

申请号：US17200155

申请日：2021-03-12

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  Channing P. Favreau ,  Erika Klek

IPC: H01Q21/06 ,  H05K1/02

Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.

公开(公告)号：US20240305011A1

公开(公告)日：2024-09-12

申请号：US18668328

申请日：2024-05-20

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  Channing P. Favreau ,  Erika Klek

IPC: H01Q21/00 ,  H01Q21/24 ,  H05K1/02

CPC classification number: H01Q21/0025 ,  H01Q21/24 ,  H05K1/0243 ,  H05K2201/10098

Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.

公开(公告)号：US20230231371A1

公开(公告)日：2023-07-20

申请号：US17658344

申请日：2022-04-07

Applicant: Raytheon Company

Inventor： Channing P. Favreau ,  Alexander Gilbert ,  Thomas V. Sikina

IPC: H02G15/10 ,  H05K5/02

CPC classification number: H02G15/10 ,  H05K5/0247

Abstract: Methods and apparatus for a housing assembly including a housing comprising a conductive material, a conductor extending through the housing, and a dielectric material at least partially surrounding the conductor. Portions of the housing may surround the conductor such that the conductor, the dielectric, and the portions of the housing form a channel through the housing.

公开(公告)号：US11336032B2

公开(公告)日：2022-05-17

申请号：US16874790

申请日：2020-05-15

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  Channing P. Favreau

IPC: H01Q1/22 ,  H01Q23/00 ,  H01L23/66 ,  H01Q1/48 ,  H01Q9/04

Abstract: Methods and apparatus for providing a radiator having an antenna comprising a patch antenna layer and a first ground plane layer, wherein the antenna has a reactive field region of the radiator between the patch antenna layer and the first ground plane layer, and an integrated circuit located in the active region.

公开(公告)号：US20240387972A1

公开(公告)日：2024-11-21

申请号：US18640815

申请日：2024-04-19

Applicant: Raytheon Company

Inventor： Channing P. Favreau ,  Lawrence A. Binek

IPC: H01P3/08 ,  H01P11/00

Abstract: An additively-manufactured electrical transmission line is made as a single, unitary continuous monolithic additively-manufactured piece of material, including an outer housing defining a cavity therewithin, a conductive stripline passing through the cavity, and stubs within the cavity electrically coupling the outer housing to the stripline. The stripline may be a flat stripline. The stubs may be angled relative to the stripline, to facilitate surface treatment within the housing, such as abrasive flow machining to reduce surface roughness, which may be part of a method of making the electrical transmission line. The electrical transmission line may be part of an electrical installation including multiple such electrical transmission lines, which may have shapes, including curved shapes, for making desired electrical connections between components.

公开(公告)号：US11317502B2

公开(公告)日：2022-04-26

申请号：US16874794

申请日：2020-05-15

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  William J. Clark ,  Channing P. Favreau ,  Erika Klek ,  Mikhail Pevzner ,  Donald G. Hersey ,  Gregory G. Beninati ,  Thomas J. Tellinghuisen

IPC: H05K1/00 ,  H05K1/02 ,  H01P1/20 ,  H05K7/14

Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.